Our ASMPT SMT Solutions and ASMPT Semiconductor Solutions segments are growing together, pulling in the same direction and offering integrated solutions.
We are growing together because we have a common vision: Enabling the digital world. We are innovation and market leaders in the electronics manufacturing industry. We offer semiconductor solutions, advanced packaging solutions and SMT solutions. And that’s not all: We help our customers to become future-proof with intelligent production lines and to master the challenges facing the electronics industry today and tomorrow.
Integration is also advancing in terms of processes. The best example is the SIPLACE CA from ASMPT SMT Solutions, a placement machine that combines chip and SMT assembly in a single solution. The SIPLACE CA is the first high-speed platform with which the assembly of bare dies directly from the wafer and classic SMT assembly from feeder can be flexibly combined.
Under the motto “Smart Automotive Solutions”, ASMPT Semiconductor Solutions is launching two new machines that are of special interest for makers of automotive electronics. With the new version of the AMICRA NOVA Pro, ASMPT offers one of the most advanced die bonding systems currently available, while the AEi CMAT-S is a complete system for the assembly and dynamic alignment of lenses in ADAS cameras.
As one of the most advanced die bonding systems on the market, the new version of the AMICRA NOVA Pro impresses with its flexibility, speed and precision. The platform combines high placement accuracy with short cycle times and innovative bonding technologies.
“For speedy data transmission and precise sensor technology you need equally precise manufacturing technologies,” explains Johann Weinhaendler, General Manager at ASMPT AMICRA in Regensburg, Germany. “To meet the enormous increase in demand in areas like optoelectronics or advanced packaging, many electronics manufacturers are currently upgrading their lines. Demand is growing particularly strongly in the silicon photonics sector. For example, you can produce active optical cables for 400/800-Gbps networks or co-packaged optics with the NOVA Pro.”
The NOVA Pro places dies in sizes ranging from 0.1 to 25 millimeters with a maximum accuracy of ±1 micron @ 3σ at speeds of up to 1000 units per hour (UPH). At ±3.0 microns @ 3σ it achieves even 3500 UPH. This impressive level of performance is also achieved in flip-chip mode.
The NOVA Pro ensures its trend-setting placement accuracy with its unique dynamic alignment method in combination with laser-based substrate heating technology. And thanks to its Active Bond Force Control, the machine can dose bonding forces with exceptional precision ranging from 10 g to 5000 g. Using an epoxy resin stamp with volumetric dosing, the dies can be affixed with adhesives that get UV-cured in place. The repertoire of precision die fastening methods includes in-situ bonding as well as eutectic die bonding with a bonding tool (up to 350 °C), a ceramic pulse heater (up to 500 °C), or a contactless laser (up to 450 °C). An integrated post-bond inspection ensures maximum quality. With its very generous substrate area of 550 × 600 mm, the NOVA Pro is aimed at the die-bonding market in advanced packaging applications.
“Anyone who opts for the NOVA Pro benefits from the many years of experience of the market leader who is fully committed to the goal of zero DPMO,” says Johann Weinhaendler. “The high reserves in terms of precision and performance as well as the flexible fixation and bonding options make this machine a future-proof investment.”
With this machine, ASMPT AEi introduces a powerful implementation of its patented continuous sweep alignment process, which significantly improves the total system throughput without compromising on the quality of cameras installed in advanced driver assistance systems. The main advantage of the CMAT-S is its ability to reduce the process cycle time by 50 percent without adding to the machine’s footprint.
The CMAT-S aligns lenses for ADAS cameras with the unprecedented speed of ten seconds or less per camera. It employs a proprietary and patented algorithm for its active alignments. Unlike traditional systems that rely on static positioning during image acquisition, the CMAT-S takes advantage of the continuous movement of the target object during the imaging process. This dynamic approach increases the precision and speed of the alignment process. The result is a uniform focus across the entire field of view. To quickly lock the aligned lens in position, the machine is equipped with an innovative UV curing system with partial curing times of as little as one second for certain camera modules.
“Our innovations are primarily aimed at the large-scale production of cameras in automobiles, a market segment that is rapidly growing with the increasing introduction of advanced driver assistance systems. Our efforts underscore our unwavering commitment to efficiency and excellence in automotive camera manufacturing,” says Jean-Marc Peallat, General Manager at ASMPT AEi.
