Senior Manager, Product Marketing
Our focused SMT topics
FACTS ON OPEN AUTOMATION
Next livestream: August, 31, 9:00 CET
OPEN AUTOMATION WHITE PAPER
You can find our comprehensive guide for your automation plans here
ASM IMPACT release summer 2022
All highlights of our latest innovations can be found here here
Integrate high-growth technologies of the future such as flip chips and die attach into your SMT production with the SIPLACE CA, the world’s first platform that lets you flexibly combine the placement of bare dies directly from the wafer with classic feeder-based SMT placement. Your competitive advantage: New, future-proof applications can be implemented on a single SMT line without any additional special processes. It is the ideal machine for “Advanced Packaging” applications. Another benefit: For all other jobs, the SIPLACE CA operates as a powerful “normal” SMT placement machine.
Highlights of the SIPLACE CA:
Extremely fast and with long-term precision
The first head that changes its mode on demand
As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.