SMT topics in focus
ASMPT is the world’s largest manufacturer of stencils for industrial printing applications because of the high quality and reliability of our products and services. All of ASMPT’s factories and partners in the global stencil network operate with the same materials, the same equipment, and in accordance with strictly certified procedures. This enables us to supply our customers quickly and with consistently high quality – no matter where they may be located.
All ASMPT factories and partners in the global stencil network operate with the same materials and equipment in accordance with strictly certified procedures.
The quality of the stencil is a critical factor in the printing process. Stable and cost-effective printing processes can only be achieved with materials that are precisely manufactured and extremely resilient. ASMPT produces stencils with a wide range of technologies – from classic laser cutting to high-precision electroforming, and from single level to multi-level stencils. The broad portfolio of our award-winning DEK stencil and frame solutions features perfectly coordinated high-quality products for all requirements ranging from standard SMT applications to the production of the most complex modules.
The fine grain of stainless steel used for DEK Fine Grain stencils facilitates smoother laser-cut apertures to encourage better paste release and transfer efficiency for challenging dimensions.
Produced with the latest micro-milling technology, DEK Multi-level (step) stencils offer extremely tight tolerances to allow consistent printing for PCBs that contain fine-pitch parts arranged over a large area and/or a high mix of components. Exceptional accuracy and repeatability are possible with single stencil printing, even with complex board designs.
Using an additive production process, DEK Electroform solutions ensure extreme stencil thickness control for deposit uniformity across multiple applications including standard SMT, micro-SMD, semiconductor, solar and LED lighting. This stencil technology allows printing of very complex designs, into cavities and multiple levels, and around components. With its center of competence in Singapore, ASM develops new manufacturing processes such as electroplating solutions for stencils.
Eliminate secondary printing or dispensing processes with DEK Electroform 3D stencils. Now you can deposit material onto non-flat surfaces, around protrusions and inside cavities in a single stroke.
PCBs that incorporate both miniaturized and large components can often be difficult to print in one stroke due to the different paste volume requirements. DEK Electroform variable aperture height technology (VAHT) solves this issue with aperture-specific gasket overgrowths that create more height for larger paste volume deposits. Around defined apertures, gasket height can be 1 to 2 mils higher than the base stencil thickness.
The challenges related to stencil printing for mini LED products involve printing paste deposits which are smaller than 100μm in size and controlling the uniformity of the paste deposits to avoid die tilt, bridging and other defects. Electroform is uniquely positioned to address these challenges.
As an alternative to the slower serial process of needle dispensing, the DEK PumpPrint™/Adhesive stencils allow parallel processing of adhesive materials, printing them in a single stroke. A unique acrylic construction and precisely machined apertures facilitate adhesive deposits ranging from 75 µm to 1 mm in height.
DEK Stencil coatings are extremely thin fluxophobic coatings that can be applied to the stencil surface and/or aperture interior walls. Solder paste is prevented from adhering to the coated areas, helping reduce required understencil cleaning frequency and, in the case of coated apertures, encourage better material transfer efficiency.
Applied immediately following stencil production, DEK NanoUltra Gold covers the underside of the stencil and the aperture walls with a hydrophobic and oleophobic permanent coating. The coating provides improved print definition for challenging Area Ratios, better transfer efficiency and reduced understencil cleaning frequencies.
A self-applied nano stencil coating technology that comes conveniently packaged in a single-use, cost-effective wipe, NanoClear® helps reduce cleaning frequency and eliminate common defects such as bridging, insufficient material and solder balling.
Declines in tension and surface quality, which are normal as stencils age, reduce the quality, yield and process stability of the solder paste printing process. The RFID tags provided by ASMPT make it possible for the first time to monitor the service life of stencils as easily and conveniently as seamlessly. DEK printers equipped with the Smart Stencil option record each printing cycle on the RFID tag even if the stencil is used in different lines. Never again will the use of outdated stencils hurt the quality and efficiency of your printing process.
Discover the advantages of Smart Stencils.
Order DEK Stencils in the ASMPT Webshop
As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.