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SMT topics in focus


SMT topics in focus

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High-speed chip assembly directly from wafer and SMT placement in one machine

Smart devices, 5G communication standards, autonomous driving: Only consistent miniaturization and ever-increasing complexity in electronics make all of this possible. The key technology behind this is System in Packages (SiP): ICs and SMT components are combined into a compact, highly innovative system.

As a hybrid combination of a SMT placement machine and a die bonder, the new SIPLACE CA2 can process both SMDs supplied from changeover tables and feeders as well as dies taken directly from the sawn wafer in a single work step. By integrating the complex die bonding process into the SMT line it eliminates the need for special machines in production. With reduced personnel deployment, high connectivity, and integrative data utilization, the SIPLACE CA2 is therefore the perfect match for the Intelligent Factory. 

Placement directly from the wafer: more cost-effective and sustainable

Discover the efficiency of direct wafer placement: By eliminating the taping process, operators have fewer replenishment and splicing tasks as well as less effort for material feeding. With full SiP production in 24/7 operation, the SIPLACE CA2 can amortize itself within a year, as it saves an impressive 800 kilometers of tape per year.

Two worlds in one machine

Maximum productivity

Processes SMT components and dies directly from the wafer with die-attach and flip-chip processes in the same work step.

Two machines - one line

The combination of the SIPLACE CA2 with the SIPLACE TX micron high-speed placement machine from ASMPT is particularly interesting in SiP production: both machines can be installed in one production line and complement each other - for maximum flexibility and maximum yield.

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We offer for existing and potential ASMPT SMT equipment users custom-tailored, in-depth product demonstrations which you can view in the comfort of your own office.
Are you interested? Please feel free to contact us.


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Best-in-class solutions

As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.

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