From Advanced Packaging to Intelligent Factories At SEMICON Southeast Asia 2026, ASMPT will demonstrate how the integration of semiconductor and electronics manufacturing technologies supports production ready implementation across the manufacturing value chain. Exhibits from ASMPT Semiconductor Solutions, ASMPT SMT Solutions, and Critical Manufacturing illustrate a combined approach spanning advanced packaging, precision assembly, and factory level information flow. Packaging and assembly solutions for Intelligence Revolution The ASMPT booth will showcase advanced packaging and assembly technologies for co-packaged optical and photonic components, high-performance computing, energy management, computer systems, imaging and sensor technology, and automotive lighting. These solutions address current industry challenges, such as fine-pitch interconnects, the complexity of integration, and scalable manufacturing in semiconductor and electronics production. In addition, ASMPT will also contribute to the Advanced Packaging & Heterogeneous Integration Summit during the exhibition. On May 4, Lim Choon Khoon, Senior Vice President and Chief Counsel for Advanced Packaging at ASMPT SEMI, will discuss how a holistic approach to bonding and integration, covering materials readiness, process integration, and in line metrology, supports the industrialization of advanced packaging for AI applications. SMDs and dies on an intelligent SMT production line ASMPT SMT Solutions will demonstrate how advanced packaging capabilities are converging with SMT assembly. The award winning SIPLACE CA2 combines high speed die assembly directly from wafer with classic SMT placement in a single platform, achieving throughput rates of up to 54,000 dies and 76,000 SMDs per hour with placement accuracy of up to ±10 µm @ 3σ. SIPLACE TX micron delivers placement accuracy of up to ±10 µm at throughput rates of up to 93,000 components per hour for System in Package and advanced module applications. ASMPT WORKS Software and Factory Solutions complement the placement platforms with intelligent automation and production transparency. From assembly to intelligent factory Beyond individual assembly and packaging technologies, ASMPT will also present the MES-powered industrial operations platform for AI-ready manufacturing from its software subsidiary, Critical Manufacturing, demonstrating how manufacturers can move from connected operations to intelligent, AI-driven production environments.