PCIM 2024

Complete Process Solutions

for Power Module Assembly

ASMPT offers everything that is needed to build a modern and efficient power module manufacturing line from a single source: from wafer separation, printing, curing, die & module tacking, sintering to encapsulation.

ASMPT Solutions:

• DEK NeoHorizon: The stencil printer for semiconductor, hybrid and high-end SMT applications
• POWER VECTOR: The die, clip and component tacking tool for sintering with silver
• SilverSAM: The sintering platform for power electronics
• 3GeP: The universal transfer molding system for a wide range of packaging requirements

NEW: POWER VECTOR

Die Tacking Solution for Ag / Cu Sintering

ASMPT will present for the first time to a European audience its innovative die and module bonding platform POWER VECTOR, which is ideally suited for both processes.

The machine features bonding forces of up to 588 N and accommodates all popular processes: dry paste, wet paste, and die transfer film (DTF).

Components can be supplied via wafer, tape-and-reel, waffle pack, or tray.

Highlight features:

• Heated BH with high BF for die bonding on substrate
• Ag film handling (film stamping)
• Light BF pick head for die pickup
• Heated WH (max 140×340mm)

ALSI LASER1205

Wafer Separation / Multi-Beam Laser Dicing

With the ALSI LASER1205 laser dicing platform and the patented V-DOE, users can reduce their loss rate when processing highly sensitive SiC wafers and improve their quality (e.g. die strength) while lowering their cost of ownership.

The innovative system processes wafers ranging from 10 to 250 microns in thickness with a positioning accuracy of less than 1.5 microns, all while being 50 percent faster than traditional methods.

Highlight features:

• Full cut dicing or grooving
• Thin Si MOSFET & IGBT
• SiC MOSFET & IGBT
• GaN on Si or SiC
• UNIQUE: V-DOE: reduced Heat Affected Zone (HAZ) to improve die strength