productronica 2025

ASMPT SMT Solutions’ presence at the 2025 Productronica trade fair under the motto “We Boost your Intelligent Factory” was a complete success. The exceptionally high level of interest in the new SIPLACE V and DEK TQ XL, the many lively discussions at the booth, and last but certainly not least the Global Technology Award for the SIPLACE CA2 confirmed that ASMPT SMT Solutions meets the needs of the market with its solutions and its technological direction.

A big audience magnet was the newly developed SIPLACE V placement platform for intelligent manufacturing. Designed for maximum performance, it delivers output increases of up to 30 percent under realistic and demanding production conditions in key industries. The new machine platform impressed the trade audience with its exceptional flexibility, top quality, and superior floorspace performance. In a footprint of merely 1.1 by 2.4 meters, its optimized placement heads can assemble up to 105,000 components per hour with a precision of 25 µm @ 3 σ. Thanks to its broad component spectrum, which ranges from 016008M chips to large BGAs and OSCs, it offers the widest possible scope of applications. And since the future-oriented architecture of the SIPLACE V opens up generous performance reserves for future automation and AI functions, it also provides long-term investment protection – all while being fully compatible with existing hardware and software solutions from ASMPT.

With its SIPLACE CA2, ASMPT demonstrated at the Productronica how placement technology and semiconductor manufacturing can be combined in one intelligent solution. The hybrid assembly platform processes both taped SMDs and dies taken directly off the sawed wafer in a single process step, thus making the entire die taping process superfluous – an advantage that reduces costs and minimizes waste significantly. The machine’s forward-looking approach also convinced the jury of the Global Technology Awards.

Another exhibit that garnered lots of interest was the new DEK TQ XL, a high-end solder paste printer for large-format circuit boards that was developed especially for high-performance computing and AI applications. The improved OSC Package from ASMPT showed how large, complex components and BGAs can be reliably integrated into the production processes of SMT lines. ASMPT’s Productronica presence was topped off by the company’s software portfolio with its WORKS Software Suite and Factory Solutions, both of which focus on consistent digitalization and intelligent process optimization.

With its combination of new hardware generations, prize-winning solutions and future-oriented software, ASMPT once again demonstrated at this year’s Productronica how modern electronics production is being shaped for today and tomorrow.