ASMPT looking back on a successful APEX EXPO 2026

The SIPLACE V platform, which was newly developed from the ground up, had its premiere in the American market at the APEX EXPO 2026 under the motto “A new era begins”. Under real-life production conditions, it delivers performance improvements of up to 30 percent in key electronics manufacturing markets by combining high placement performance with maximum precision and flexibility. It handles a wide range of components ranging from super-small 016008M components to large and complex odd-shaped components and BGAs with maximum process stability.

The SIPLACE V placement platform was also designed to meet the future requirements of electronics manufacturers in terms of its system architecture. Its powerful high-speed data communication over Gigabit Ethernet provides the foundation of end-to-end connectivity, machine-to-machine communication, and data-based production optimization. The open platform concept creates the conditions for further automation as well as for applications in the areas of big-data analytics and artificial intelligence. At the same time, it remains fully compatible with existing hardware and software solutions from ASMPT and can be seamlessly integrated into existing SMT lines.

Growth industries drive demand

The interest in the new machine was particularly strong from manufacturers in industries that are currently experiencing dynamic growth. “The discussions at the APEX event showed how strong the investment dynamics currently are in the North American market,” said Alexander Hagenfeldt, General Manager ASMPT SMT USA & Canada. “Applications in the areas of AI infrastructure, high-performance computing and modern data center operations are the main drivers in the demand for powerful SMT solutions. With the new SIPLACE V platform, we are addressing precisely these requirements.”

Complementing its placement technology, ASMPT presented another innovation for demanding applications with the new DEK TQ XL solder paste printer. The system expands the proven DEK TQ platform and is specifically designed for processing oversized circuit boards. It handles boards up to 850 × 610 mm, with a thickness of up to 8 mm and a weight of up to 12 kilograms, even with warpage of up to 4 mm, while printing across the entire PCB surface.

ASMPT’s integrated software portfolio also attracted a great deal of interest. Many visitors learned how hardware and software can be merged to form a fully connected and data-driven intelligent production network.

Expansion of the U.S. service organization

The strong response at the fair also underscored the growing strategic importance of the American market for ASMPT. To better support local customers with a high level of technical expertise and service quality, ASMPT is expanding its service organization in the U.S.

With these investments, ASMPT is strengthening its presence in the North American market and underscoring its commitment to supporting electronics manufacturers not only with powerful hardware and integrated software, but also with a strong local service organization.