SIPLACE SX

Our placement solution for high-mix electronics production

What happens when the most demanding electronics manufacturers get together with the most innovative developers? They go to work to make the best placement solution on the market even better. The new generation of the SIPLACE SX placement platform is now faster, more accurate and more flexible. It is also smart, open, learns quickly, adapts to any challenge, and makes your employees’ lives.

Capacity on Demand

The SIPLACE SX puts an end to rigid line concepts and fixed capacities. When demand rises and short-term order changes loom, the SIPLACE SX allows you to quickly adapt your production to volatile markets. You can add or remove SIPLACE SX gantries in minutes, enabling you to increase line capacities or shift them to other lines suffering from bottlenecks. The result: Your production becomes dynamic and adapts optimally to current requirements.

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SIPLACE SX

Maximum flexibility for the intelligent factory

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Case Study System Electronics: Electronics production that's state-of-the-art

Our customers look for excellence. SIPLACE SX placement machines perfectly reflect our core competencies of flexibility and quality.

Andrea Gozzi, General Manager at System Electronics

Read the Case Study

SIPLACE OSC Package

Power electronics for demanding applications like electromobility increase the need for odd-shaped components (OSCs). With the SIPLACE SX, you integrate the handling of OSCs as well as the clinching process into the SMT line and master all challenges through the perfect interaction of the placement head and the vision system.

Your benefits:

Placement forces of up to 100 N
Snap-in detection for connectors
Real-time 3D measurement of contact pins
Automatic optimization of placement speed
Automatic adjustment of lighting parameters for optical centering of odd-shaped components
Detection of broken components via the component camera prior to pickup
Processing of components weighing up to 300 g
Measurement of components’ mass inertia

SIPLACE SX at a glance

Capacity on Demand: Scale the performance of your SMT lines up or down as needed – quickly and easily
Smart Transport Module: Process PCBs with lengths of up to 1.525 meters
LED centering: Align components based on top-side features
Place critical components reliably with the OSC Package
Touchless placement: Maximum placement quality for highly sensitive components
Placement Head CP20 and Placement Head CPP: heads can operate jointly in the same placement area for more flexibility and performance.
Minimum placement force: 0.5 N
Smart Pin Support: Automated pin support for printed circuit boards
Pin-one detection

	SIPLACE SX1	SIPLACE SX2
贴装速度(ASMPT)	43,000 cph	86,500 cph
贴装速度 (IPC)	33,000 cph	66,000 cph
机器尺寸	1.5 m × 2.4 m × 1.6 m (长×宽×高)

M2M communication interfaces: IPC-HERMES-9852, WORKS Operations Information Broker, IPC-CFX
WORKS Software Suite: In combination with WORKS Software Suite applications, you can automate process optimization, material supply and operator control operations as well as program changeovers during product changes.
SMT Analytics: In-depth analysis software for improving assembly throughput rates and lowering manufacturing costs by recognizing even hard-to-pinpoint deficits.

CP20 Head – for maximum accuracy and speed:
- for components ranging from 0.12 × 0.12 mm (L × W) to 8.2 mm × 8.2 mm and 4 mm (L × W × H)
- Speed: Up to 43,250 cph
- Accuracy: Up to ±34 μm @ 3 σ
- Placement force: 0.5 N to 4.5 N
- perfect for the fast assembly of standard components at the head of the SMT line
CPP Head – for maximum flexibility:
- switches as needed between pick-and-place, collect-and-place and mixed modes
- for components ranging from 01005 metric to 50 × 40 x 15.5 mm (L × W × H)
- Speed: Up to 23,500 cph
- Accuracy: Up to ±30 μm @ 3 σ
- for perfectly balanced line operation during quick product changeovers with no time-consuming configuration and head changes
Twin Head – for maximum force:
- places components ranging from 0201 metric to 200 × 150 × 25 mm (L×W×H)
- Speed: Up to 5,500 cph
- Accuracy: Up to ±26 μm @ 3 σ
- Placement force: 1.0 N to 100 N
- Snap-in detection and 3D measurement in real time
- perfectly suited for automated end-of-line placement of large and heavy components such as connectors, specialty components, and odd shapes
SIPLACE Tray Unit: For non-stop supply of components from compact trays
SIPLACE Smart Features: more transport options and process flexibility with consistently high speed and accuracy
- automatic pitch detection for 8-mm tapes
- Recognition of tombstoned, rotated and tilted components
- programmable placement angle
- automatic detection and replacement of dirty nozzles
- optical centering of the component before measurement with BE camera

Capacity on Demand: Scale the performance of your SMT lines up or down as needed – quickly and easily
Smart Transport Module: Process PCBs with lengths of up to 1.525 meters
LED centering: Align components based on top-side features
Place critical components reliably with the OSC Package
Touchless placement: Maximum placement quality for highly sensitive components
Placement Head CP20 and Placement Head CPP: heads can operate jointly in the same placement area for more flexibility and performance.
Minimum placement force: 0.5 N
Smart Pin Support: Automated pin support for printed circuit boards
Pin-one detection

	SIPLACE SX1	SIPLACE SX2
贴装速度(ASMPT)	43,000 cph	86,500 cph
贴装速度 (IPC)	33,000 cph	66,000 cph
机器尺寸	1.5 m × 2.4 m × 1.6 m (长×宽×高)

M2M communication interfaces: IPC-HERMES-9852, WORKS Operations Information Broker, IPC-CFX
WORKS Software Suite: In combination with WORKS Software Suite applications, you can automate process optimization, material supply and operator control operations as well as program changeovers during product changes.
SMT Analytics: In-depth analysis software for improving assembly throughput rates and lowering manufacturing costs by recognizing even hard-to-pinpoint deficits.

CP20 Head – for maximum accuracy and speed:
- for components ranging from 0.12 × 0.12 mm (L × W) to 8.2 mm × 8.2 mm and 4 mm (L × W × H)
- Speed: Up to 43,250 cph
- Accuracy: Up to ±34 μm @ 3 σ
- Placement force: 0.5 N to 4.5 N
- perfect for the fast assembly of standard components at the head of the SMT line
CPP Head – for maximum flexibility:
- switches as needed between pick-and-place, collect-and-place and mixed modes
- for components ranging from 01005 metric to 50 × 40 x 15.5 mm (L × W × H)
- Speed: Up to 23,500 cph
- Accuracy: Up to ±30 μm @ 3 σ
- for perfectly balanced line operation during quick product changeovers with no time-consuming configuration and head changes
Twin Head – for maximum force:
- places components ranging from 0201 metric to 200 × 150 × 25 mm (L×W×H)
- Speed: Up to 5,500 cph
- Accuracy: Up to ±26 μm @ 3 σ
- Placement force: 1.0 N to 100 N
- Snap-in detection and 3D measurement in real time
- perfectly suited for automated end-of-line placement of large and heavy components such as connectors, specialty components, and odd shapes
SIPLACE Tray Unit: For non-stop supply of components from compact trays
SIPLACE Smart Features: more transport options and process flexibility with consistently high speed and accuracy
- automatic pitch detection for 8-mm tapes
- Recognition of tombstoned, rotated and tilted components
- programmable placement angle
- automatic detection and replacement of dirty nozzles
- optical centering of the component before measurement with BE camera

ASMPT combines a seamless product portfolio with a decidedly customer-friendly service mentality. They also impressed us with their commitment to sustainability.

Dominik Heber, Supervisor of Production Area SMD at elobau