SIPLACE TX micron

Maximum accuracy and efficiency for SiPs and modules

借助SIPLACE TX micron，您可以使用最先进的SMT技术（性能高达93,000 cph）和前所未有的精度运行先进封装和高密度应用。一台机器提供三个精度等级：20、15和10µm@3 σ，贴装间距可以小至50µm。SIPLACE TX micron的性能和可升级性保护了您的投资。

凭借智能功能，例如全新的高解析度PCB相机，灵活的多功能双轨选项，在带有 SIPLACE料盘单元的JEDEC料盘中不间断供应元器件，开放接口标准和强大的控制软件，SIPLACE TX micron可以无缝地融入模块化，灵活和独立于制造商的开放式自动化概念，始终保证集成智能工厂的最大生产力和产量。

产品手册

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两台机器 —— 一条生产线

SIPLACE TX micron和SIPLACE CA2可以设置在同一条生产线上，这为制造商带来了几个优势：

更简单的内部物流：在生产中，进行裸芯片和SMT贴装时，无需再PCB必须来回运输的贴装解决方案
更低的成本：主动器件不再有编带
更环保：减少料带浪费
更高效的流程: active components (from the wafer) and passive components (tape and reel) can be combined in one line, eliminates taping, splicing or refilling of the more expensive active components, meaning fewer errors possible

多功能双轨

多功能双轨是一个可选的传输带，它提供了更多的灵活性，可用于以下情况：

更多的运输选择和工艺灵活性，始终如一的高处理速度 —— 即使是严重弯曲或更重或更厚的PCB也没有问题
可以传输厚度达13,5毫米 (含翘曲) 的PCB
使用“厚”载具 (通常用于先进封装的单一基板)
使用JEDEC托盘作为基板载具
使用带有高定位Pin的载具
最大PCB重量可达8公斤

Support tools or vacuum tools up to a weight of 35 kg
Clamping rails can be easily exchanged
Clamping and release speed can be programmed
Using of masks or "clamping fingers", if needed

較少資訊

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SIPLACE料盘单元

SIPLACE料盘单元能够在一个设计紧凑的的托盘中不间断地续料。最大灵活性有以下几点:

生产力：不间断续料，快速更换载具完成续料
存储区：主存储区30个料盘 + 缓存区12个料盘
料盘尺寸：355 mm x 275 mm（相当于两个并排的JEDEC制式料盘）
占地面积：最大限度地减少突出，保持了整线最小的宽度
随机设置：每一层都有RFID标签
指示清晰：每一级都有LED指示灯

SIPLACE TX micron 概览

Accuracy combined with efficiency: An accuracy rating of 10 µm @ 3 sigma and performance that sets new standards for advanced packaging and system-in-package (SiP) applications.
Top placement quality: Developed for extremely tight component spacing, smallest ball diameters and sensitive dies to ensure maximum process quality.
Maximum protection for sensitive components: Individual adjustments of force, motion profiles and placement parameters for improved DPM rates.
Seamless traceability: Full tracking from tape to final product ensures maximum process control.
Component inspection for maximum yields: Accurate component sensor and advanced die-crack and die-chipping detector ensure maximum quality.
Maximum flexibility for any production: Extended conveyor options for thick and/or warped boards, JEDEC trays and J-boats deliver total flexibility for individual production requirements.
Flux detection & inspection: Optical control ensures maximum yields when using dipping units.
Cleanroom-compatible & standard-compliant: Certified according to Class 7 (DIN EN ISO 14644-1) and SEMI S2/S8 – ideal for high-tech environments.

	SIPLACE TX2i micron	SIPLACE TX2 micron
Placement speed	up tp 93.000 cph	up to 85.500 cph
Standard accuracy	20µm @ 3 sigma	20µm @ 3 sigma
Accuracy class	15µm @ 3 sigma	15µm @ 3 sigma
Accuracy class	10µm @ 3 sigma	10µm @ 3 sigma
PCB dimensions (l x w):	up to 375 mm x 460 mm (single-lane mode) up to 375 mm x 260 mm (dual-lane mode) up to 590 mm x 460 mm (long board option) up to 300 mm x 240 mm für 15µm @ 3 sigma (with vacuum transportation) up to 250 mm x 100 mm für 10µm @ 3 sigma (with vacuum transportation)	up to 375 mm x 460 mm (single-lane mode) up to 375 mm x 260 mm (dual-lane mode) up to 590 mm x 460 mm (long board option) up to 300 mm x 240 mm für 15µm @ 3 sigma (with vacuum transportation) up to 250 mm x 100 mm für 10µm @ 3 sigma (with vacuum transportation)
Feeder slots	up to 80 x 8 mm feeders	up to 80 x 8 mm feeders
Machine dimensions (l x w x h)	1,00 m × 2,23 m × 1,45 m	1,00 m × 2,47 m × 1,45 m

机器到机器通讯: IPC-HERMES-9852, IPC-2591 CFX, IPC-SMEMA-9851
WORKS 软件套件 : 凭借强大的WORKS软件，您可以最大限度地利用您的生产线和SIPLACE TX，同时减少员工的工作量，控制和优化您的生产和物料流。
SMT Analytics: 深度分析软件能够识别容易被忽视的缺陷，从而提高生产效率并降低生产成本。

CP20 贴装头 – 最高贴装精度和速度:
- 适用于最小，最敏感的元件：0201公制至 8.2mm × 8.2mm 及 4 mm (L × W × H)
- 速度极快: 高达46,500 cph
- 精度极高: 高达±10 μm @ 3 σ
- 非接触拾取和零压力贴装
CPP 贴装头 – 最大灵活性:
- 元件范围：从0402公制至 27 × 27 x 6 mm (L × W × H)
- 贴装速度: 高达 23,850 cph
- 贴装精度: 高达 ±20 μm @ 3 σ
- 在快速换线过程中，完美平衡的生产线操作，无需耗时的配置和贴装头更换
NEW Multi Purpose Dual Conveyor: more transport options and process flexibility with consistently high speed and accuracy
Linear Dipping Unit (LDU): For efficient placements of smaller quantities and multi-die placements
Die Level Traceability: Individual tracking and tracing of components from tape to finished product
On Board PCB Inspection: Solder paste pre- and post placement inspection for 0 DPMO
Smart nozzle reader: Detects smart nozzles with unique IDs for optimal process control
SIPLACE Tray Unit: Non-stop supply of components from compact trays
NEW Long Board Option (LBO): PCBs measuring up to 590 mm × 460 mm (L × W)
NEW larger vacuum tooling: Assemble circuit boards measuring up to 300 × 240 mm (L × W) with an accuracy rating of up to ±15 μm @ 3 σ

Accuracy combined with efficiency: An accuracy rating of 10 µm @ 3 sigma and performance that sets new standards for advanced packaging and system-in-package (SiP) applications.
Top placement quality: Developed for extremely tight component spacing, smallest ball diameters and sensitive dies to ensure maximum process quality.
Maximum protection for sensitive components: Individual adjustments of force, motion profiles and placement parameters for improved DPM rates.
Seamless traceability: Full tracking from tape to final product ensures maximum process control.
Component inspection for maximum yields: Accurate component sensor and advanced die-crack and die-chipping detector ensure maximum quality.
Maximum flexibility for any production: Extended conveyor options for thick and/or warped boards, JEDEC trays and J-boats deliver total flexibility for individual production requirements.
Flux detection & inspection: Optical control ensures maximum yields when using dipping units.
Cleanroom-compatible & standard-compliant: Certified according to Class 7 (DIN EN ISO 14644-1) and SEMI S2/S8 – ideal for high-tech environments.

	SIPLACE TX2i micron	SIPLACE TX2 micron
Placement speed	up tp 93.000 cph	up to 85.500 cph
Standard accuracy	20µm @ 3 sigma	20µm @ 3 sigma
Accuracy class	15µm @ 3 sigma	15µm @ 3 sigma
Accuracy class	10µm @ 3 sigma	10µm @ 3 sigma
PCB dimensions (l x w):	up to 375 mm x 460 mm (single-lane mode) up to 375 mm x 260 mm (dual-lane mode) up to 590 mm x 460 mm (long board option) up to 300 mm x 240 mm für 15µm @ 3 sigma (with vacuum transportation) up to 250 mm x 100 mm für 10µm @ 3 sigma (with vacuum transportation)	up to 375 mm x 460 mm (single-lane mode) up to 375 mm x 260 mm (dual-lane mode) up to 590 mm x 460 mm (long board option) up to 300 mm x 240 mm für 15µm @ 3 sigma (with vacuum transportation) up to 250 mm x 100 mm für 10µm @ 3 sigma (with vacuum transportation)
Feeder slots	up to 80 x 8 mm feeders	up to 80 x 8 mm feeders
Machine dimensions (l x w x h)	1,00 m × 2,23 m × 1,45 m	1,00 m × 2,47 m × 1,45 m

机器到机器通讯: IPC-HERMES-9852, IPC-2591 CFX, IPC-SMEMA-9851
WORKS 软件套件 : 凭借强大的WORKS软件，您可以最大限度地利用您的生产线和SIPLACE TX，同时减少员工的工作量，控制和优化您的生产和物料流。
SMT Analytics: 深度分析软件能够识别容易被忽视的缺陷，从而提高生产效率并降低生产成本。

CP20 贴装头 – 最高贴装精度和速度:
- 适用于最小，最敏感的元件：0201公制至 8.2mm × 8.2mm 及 4 mm (L × W × H)
- 速度极快: 高达46,500 cph
- 精度极高: 高达±10 μm @ 3 σ
- 非接触拾取和零压力贴装
CPP 贴装头 – 最大灵活性:
- 元件范围：从0402公制至 27 × 27 x 6 mm (L × W × H)
- 贴装速度: 高达 23,850 cph
- 贴装精度: 高达 ±20 μm @ 3 σ
- 在快速换线过程中，完美平衡的生产线操作，无需耗时的配置和贴装头更换
NEW Multi Purpose Dual Conveyor: more transport options and process flexibility with consistently high speed and accuracy
Linear Dipping Unit (LDU): For efficient placements of smaller quantities and multi-die placements
Die Level Traceability: Individual tracking and tracing of components from tape to finished product
On Board PCB Inspection: Solder paste pre- and post placement inspection for 0 DPMO
Smart nozzle reader: Detects smart nozzles with unique IDs for optimal process control
SIPLACE Tray Unit: Non-stop supply of components from compact trays
NEW Long Board Option (LBO): PCBs measuring up to 590 mm × 460 mm (L × W)
NEW larger vacuum tooling: Assemble circuit boards measuring up to 300 × 240 mm (L × W) with an accuracy rating of up to ±15 μm @ 3 σ