ASMPT SMT解决方案

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DEK Galaxy

先进封装和高精度SMT装配

The DEK Galaxy printer delivers exceptional performance, flexibility, and maximum precision (±12.5 μm @ 2cmk), all with a fast 7-second cycle time. Designed to meet diverse production requirements, it enables seamless transitions between wafer bumping with solder paste printing, SMT pre-assembly for next-generation assemblies, and DirEKt Ball Attach on wafers or substrates with ball diameters as small as 0.2 mm.

With a range of configuration options, the DEK Galaxy is built for efficiency and precision. Singulated tooling systems allow for individual alignment and multi-substrate printing within a single cycle. JEDEC wafer chucks and carriers ensure smooth wafer and substrate processing, while Grid-Lok® and customized tooling provide advanced substrate support, even for high-density assemblies.

Top performance and flexibility at wafer, substrate and PCB level

As a stand-alone offering or as part of a turnkey process configured by ASMPT specialists: DEK Galaxy is the ultimate performer.

DEK Galaxy概览

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