SIPLACE TX

新的高端贴装解决方案

更快、更小、更先进——新型高端贴装解决方案

我们最新一代的贴装模块在速度、单位面积产出和大批量生产应用的精度方面都刷新了记录。0201（公制）元器件首次可以最高速度贴装。

智慧灵活性和智慧性能

Highest quality placement, even at the highest throughput. With the new SIPLACE Tray Unit and two stationary high-end camera systems, the SIPLACE TX can also be used as a space-saving end-of-line machine. It boasts unique flexibility in terms of conveyor systems, component feeding and smart software options.

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SIPLACE TX

为智慧工厂提供最佳性能

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SIPLACE TX at a glance

最大产能最小的占地面积: 96,000 cph, 机器尺寸只有 1 m × 2.23 m
极大的元件范围: 元件大小从 0.12 mm × 0.12 mm 到 200 mm × 110 mm 仅仅3个贴装头就可以全部覆盖
智能成像系统: 每个元件独立成像，元件特定光源参数设定，PCB检测，异型元件贴装，裂纹检测以及更多。
灵活的轨道: 双轨和长板选项，以及高度灵活的PCB传送选择。
非接触式贴装/低压力贴装: 非接触式贴装及贴片低至0.5 N
精准元件上料: 80 × 8 mm供料器，JEDEC料盘，点胶供料器，线性点蘸单元

	SIPLACE TX2i	SIPLACE TX2	SIPLACE TX1
贴装速度	高达 96,000 cph	高达 85,500 cph	高达 43,000 cph
机器尺寸	1.00 m × 2.23 m × 1.45 m (长 x 宽 x 高）	1.00 m × 2.47 m × 1.45 m (长 x 宽 x 高）	1.00 m × 2.35 m × 1.45 m (长 x 宽 x 高）

M2M communication interfaces: IPC-HERMES-9852, IPC-2591 CFX, IPC-SMEMA-9851
WORKS Software Suite: In combination with WORKS Software Suite applications, you can automate process optimization, material supply and operator control operations as well as program changeovers during product changes.
SMT Analytics: In-depth analysis software for improving assembly throughput rates and lowering manufacturing costs by recognizing even hard-to-pinpoint deficits.

CP20 Head – for maximum accuracy and speed:
- For components ranging from 0.12 × 0.12 mm (L × W) to 8.2 mm × 8.2 mm and 4 mm (L × W × H)
- Speed: Up to 48,000 cph
- Accuracy: Up to ±25 μm @ 3 σ
- Placement force: 0.5 N to 4.5 N
- Perfect for the fast assembly of standard components at the head of the SMT line
CPP Head – for maximum flexibility:
- Switches as needed between pick-and-place, collect-and-place and mixed modes
- For components ranging from 01005 metric to 50 × 40 x 15.5 mm (L × W × H)
- Speed: Up to 25,500 cph
- Accuracy: Up to ±34 μm @ 3 σ
- For perfectly balanced line operation during quick product changeovers with no time-consuming configuration and head changes
Twin Head – for maximum force:
- Places components ranging from 0201 metric to 200 × 110 × 25 mm (L×W×H)
- Speed: Up to 5,500 cph
- Accuracy: Up to ±22 μm @ 3 σ
- Placement force: 1.0 N to 30 N
- Snap-in detection and 3D measurement in real time
- Perfectly suited for automated end-of-line placement of large and heavy components such as connectors, specialty components, and odd shapes
SIPLACE Tray Unit: For non-stop supply of components from compact trays
SIPLACE Smart Features: more transport options and process flexibility with consistently high speed and accuracy
- Automatic pitch detection for 8-mm tapes
- Recognition of tombstoned, rotated and tilted components
- Programmable placement angle
- Automatic detection and replacement of dirty nozzles

最大产能最小的占地面积: 96,000 cph, 机器尺寸只有 1 m × 2.23 m
极大的元件范围: 元件大小从 0.12 mm × 0.12 mm 到 200 mm × 110 mm 仅仅3个贴装头就可以全部覆盖
智能成像系统: 每个元件独立成像，元件特定光源参数设定，PCB检测，异型元件贴装，裂纹检测以及更多。
灵活的轨道: 双轨和长板选项，以及高度灵活的PCB传送选择。
非接触式贴装/低压力贴装: 非接触式贴装及贴片低至0.5 N
精准元件上料: 80 × 8 mm供料器，JEDEC料盘，点胶供料器，线性点蘸单元

	SIPLACE TX2i	SIPLACE TX2	SIPLACE TX1
贴装速度	高达 96,000 cph	高达 85,500 cph	高达 43,000 cph
机器尺寸	1.00 m × 2.23 m × 1.45 m (长 x 宽 x 高）	1.00 m × 2.47 m × 1.45 m (长 x 宽 x 高）	1.00 m × 2.35 m × 1.45 m (长 x 宽 x 高）

M2M communication interfaces: IPC-HERMES-9852, IPC-2591 CFX, IPC-SMEMA-9851
WORKS Software Suite: In combination with WORKS Software Suite applications, you can automate process optimization, material supply and operator control operations as well as program changeovers during product changes.
SMT Analytics: In-depth analysis software for improving assembly throughput rates and lowering manufacturing costs by recognizing even hard-to-pinpoint deficits.

CP20 Head – for maximum accuracy and speed:
- For components ranging from 0.12 × 0.12 mm (L × W) to 8.2 mm × 8.2 mm and 4 mm (L × W × H)
- Speed: Up to 48,000 cph
- Accuracy: Up to ±25 μm @ 3 σ
- Placement force: 0.5 N to 4.5 N
- Perfect for the fast assembly of standard components at the head of the SMT line
CPP Head – for maximum flexibility:
- Switches as needed between pick-and-place, collect-and-place and mixed modes
- For components ranging from 01005 metric to 50 × 40 x 15.5 mm (L × W × H)
- Speed: Up to 25,500 cph
- Accuracy: Up to ±34 μm @ 3 σ
- For perfectly balanced line operation during quick product changeovers with no time-consuming configuration and head changes
Twin Head – for maximum force:
- Places components ranging from 0201 metric to 200 × 110 × 25 mm (L×W×H)
- Speed: Up to 5,500 cph
- Accuracy: Up to ±22 μm @ 3 σ
- Placement force: 1.0 N to 30 N
- Snap-in detection and 3D measurement in real time
- Perfectly suited for automated end-of-line placement of large and heavy components such as connectors, specialty components, and odd shapes
SIPLACE Tray Unit: For non-stop supply of components from compact trays
SIPLACE Smart Features: more transport options and process flexibility with consistently high speed and accuracy
- Automatic pitch detection for 8-mm tapes
- Recognition of tombstoned, rotated and tilted components
- Programmable placement angle
- Automatic detection and replacement of dirty nozzles