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“We Boost Your Intelligent Factory” – under this guiding theme, we presented a true fireworks display of innovation at productronica 2025 and experienced an exceptionally successful show.
At the center of attention was the world premiere of the SIPLACE V, which drew strong interest from the very first moment and powerfully demonstrated the potential of the next generation of placement technology.
The new DEK TQ XL, together with our solutions for advanced packaging, OSC handling, integrated software and end-to-end automation, also attracted significant interest and underscored how consistently we are advancing the intelligent factory.
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The all-new SIPLACE V platform marks the start of a new chapter in SMT production. Setting benchmarks in speed, quality and flexibility, it not only integrates smoothly into existing lines and ensures full backward compatibility, but also delivers up to 30% more performance – all within a more compact footprint.
The all-new SIPLACE V platform marks the start of a new chapter in SMT production. Setting benchmarks in speed, quality and flexibility, it not only integrates smoothly into existing lines and ensures full backward compatibility, but also delivers up to 30% more performance – all within a more compact footprint.Thanks to the increased number of feeder slots and the capability to handle very large, heavy, and complex-shaped components, the SIPLACE V L offers maximum flexibility.
One of the highlights at our booth: the new DEK TQ XL solder paste printer for large-format PCBs. Engineered to meet the toughest demands of high-performance computing and AI applications, it delivers outstanding precision and speed – even with today’s most complex designs.
首次亮相欧洲展会：SIPLACE CA2 混合式贴装平台。这款独特的混合式平台将SMT贴装与晶圆切割后的晶粒拾取工艺融为一体，为大批量制造中的先进封装技术开辟了突破性机遇。
OSC（光学检测系统）组件包：依托尖端视觉与检测技术，确保超大尺寸特殊元器件、球栅阵列封装（BGA）及高难度封装件的可靠高精度加工。
WORKS 软件套件：主动优化产线全流程工作流。ASMPT的工厂解决方案则可在很大程度上实现跨工厂工作流的自动化，例如物料管理环节。二者协同作用，既能确保流程透明化，又能提升效率 —— 为打造智能工厂铺平道路。
依托高性能多芯片键合机 MEGA 与超高精度晶粒及倒装芯片键合机 AMICRA NANO，ASMPT 展示的技术重新定义了性能、微型化与工艺可靠性领域的标准 —— 从容应对当今半导体及光电子制造领域的各类严苛挑战。
ASMPT 软件部门展示一款尖端制造执行系统（MES）—— 该系统专为满足电子制造领域的需求而设计。
Process Lens 高端 5D 焊膏检测（SPI）系统：实现速度与精度的空前融合。得益于高性能尖端算法的加持，该系统不仅能精准识别测量对象，更能深度解读测量结果。
DEK TQ 印刷机：超高速、高精度且极致节省空间。其核心节拍时间仅为 5 至 6.5 秒，精度可达 ±17.0 微米（2 cmk 水平）；同时，该设备还提供两款机型选择，进一步彰显卓越灵活性：标准款 DEK TQ 适配最大尺寸为 400×400 毫米的电路板，而 DEK TQ L 款则可适配最大尺寸达 600×510 毫米的电路板。
全新自动化功能将产线灵活性与可用性提升至新高度。
电子制造正迈入全新时代。从汽车电子、高性能计算，到人工智能、通信技术及消费电子领域，各行业对电子制造的需求正以前所未有的速度增长。但挑战与机遇并存：突破性技术不仅在效率与竞争力方面树立全新标准，更为下一代智能制造打开了大门。
At productronica 2025, ASMPT demonstrated impressively how these opportunities can become a reality – with innovative hardware and software solutions that combine productivity, quality, flexibility and connectivity. These solutions will deliver a sustainable boost to innovation and efficiency in electronics manufacturing.
The completely newly designed SIPLACE V platform delivers a performance boost of up to 30 percent under real production conditions, combining maximum speed with outstanding flexibility. With its compact footprint, full compatibility with existing ASMPT solutions, and long-term investment security, it sets new standards in electronics manufacturing.
30 % more real performance Under real production conditions, performance increases compared to conventional platforms were measured in key industries: 30% in automotive, IT, and network infrastructure, and 15% in consumer electronics and smartphones.
100 % Process Excellence The SIPLACE V platform has been completely newly developed, combining a robust machine frame, precise linear drives, and high-resolution measurement systems for precise placement up to 25 µm @ 3σ. Perfectly adjusted placement force and precise alignment ensure error-free placement.
Unlimited Flexibility Three new placement heads that can be exchanged during operation make the SIPLACE V suitable for high-speed, mixed placement, and special components. The platform covers the entire spectrum of components – from ultra-small 016008M chips to large-format components.
Ready for the future The platform's modular system architecture is open to future developments. Gigabit Ethernet connectivity and an integrative data concept pave the way for further automation, machine networking, and AI analysis steps.
Go to the SIPLACE V product page
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The new DEK TQ XL solder paste printer is developed for oversized circuit boards in the high-end segment. It expands the proven DEK TQ platform and sets new standards in board size, precision and productivity. It also fits seamlessly into ASMPT’s Intelligent Factory concept, combining maximum printing performance with end-to-end line integration.
The DEK TQ XL prints circuit boards measuring up to 850 × 610 × 8 millimeters and weighing up to 12 kilograms. It also handles warpages of up to 4 mm and prints the entire surface.
With its performance and wet-printing accuracy of ± 20 µm @ 2.0 cpk, it sets new records in its class, yet is extremely compact, measuring only 1.77 × 1.8 × 1.6 meters (L×W×H).
The ASMPT NuMotion control system with fiberoptics and a highly efficient understencil cleaning system ensures maximum printing speed. Separate linear drives shorten the cleaning cycles by up to 50 percent compared to conventional solutions, resulting in an unrivaled cycle time of only 12 seconds.
The optional Dual Access Cover makes it possible to replace paste cartridges without having to stop the machine.
As automotive applications, 5G and 6G, smart devices and many others require ever more compact and powerful components, advanced packaging becomes one of the key technologies. The hybrid SIPLACE CA2 combines high-speed chip assembly directly from the wafer with SMT placement in a single machine.
With the hybrid placement solution SIPLACE CA2, ASMPT addresses the growing demand for integrated manufacturing solutions. This enables the production of SiPs (System-in-Package modules) to be integrated directly into the SMT line. The SIPLACE CA2 processes both SMDs from tapes and dies taken directly from the wafer in a single step at speeds of up to 54,000 dies or 76,000 SMT components per hour with a precision of up to 10 microns @ 3 σ.
The result: maximum flexibility, efficiency, productivity and quality paired with enormous savings in time, costs, floor space, and tape waste.
With potential annual savings of 800 kilometers of carrier tape in 24/7 SiP production and a range of high-performance features, the SIPLACE CA2 is a future-proof and economically attractive investment.
Go to the SIPLACE CA2 product page
ASMPT SMT 解决方案为电子制造商提供先进、高性能的集成化硬件与软件解决方案，助力打造面向未来的智能化表面贴装技术生产体系，其中包括市场领先的 DEK 印刷机和 SIPLACE 贴片机。
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ASMPT 半导体（SEMI）解决方案为微电子、半导体、光子学及光电子行业提供种类丰富的先进封装与主流产品，以及集成化解决方案。ASMPT 旗下的 ALSI、AMICRA、NEXX 和 AEI 产品线均隶属于半导体业务板块。
凯睿德制造是 ASMPT 的全资子公司，提供业内最先进的制造执行系统（MES）。
优良的生产计划是确保电子生产效率、灵活性和产品质量的基础。作为行业的技术领导者，我们提供广泛的产品组合。我们的解决方案以优质的硬件、软件和服务而闻名—强大、智能，并随时准备将您的生产提升到一个新的水平。