PCIM Expo 2026

ALSI LASER1206

Next Generation Laser Dicing & Grooving Solution

Ideal platform for advanced packaging & power automotive

Highlights:

• Fully automated laser processing platform to empower the intelligence revolution
• Including multi-beam advanced laser technology offering limited heat load for the best possible process quality & high die strength
• Selected as preferred laser grooving process by leading plasma dicing supplier and confirmed by various customers
• Process of reference for advanced packaging, power automotive, AI and mobile applications
• Clean mini-environment (class 1000) guarantee: closed doors between every process module
• Capable of handling both film framed wafers & bare wafer

NEW: SilverSAM PRO

Silver Sintering Solution
 

Exclusive Oxidation-Free Vacuum Sintering Chamfer Solution by ASMPT

Highlights:

• Oxdiation free copper-friendly environment for enhancing production yield
• New advance temperature control for power box sintering (molded package to heatsink sintering)
• Flexibility with expandable volume in productivity: 1 press, 2 presses, 3 presses and 4 presses configuration
• Flexibility with multiple substrate format handling capability from master card panel DBC / AMB, singulated DBC / AMB and wafer level / leadframe power discrete

Key Application: Power module controller

MEGA

Multi-Chip Bonding Solution
 

Automatic high precision multi-chip die bonder for diverse multi-chip packages

Highlights:

• Tailor-made for MCM application with modular design
• Large substrate handling with option 280 x 300 mm
• Balancing between speed, flexibility, and accuracy
• Latest patented technologies driven precision
• Consistent quality through efficient practices

Key Application: Connectivity application for high end consumer electronics in compact size