AI服务器应用

Name: ASMPT GmbH & Co. KG
Address: Rupert-Mayer-Str. 48, Munich, 81379, DE
Telephone: +49 89 20800-22000

助力高性能计算 (HPC) PCB制造

人工智能应用正在催生新一代服务器硬件，这类设备采用结构高度复杂、元器件排布密集的印刷电路板，并搭载GPUs和TPUs等大型高价值元器件。

这一变革正从根本上重塑 SMT 生产模式。更大尺寸的电路板、更高的元器件密度，加之零缺陷的品质要求，意味着组装全流程的每一个环节都必须实现全面工艺管控。

针对以上痛点，ASMPT 推出了专为人工智能与高性能计算 (HPC) 产线打造的一体化 SMT 解决方案。

下载技术文档 (PDF)

适用于HPC SMT生产卓越的贴片机内置解决方案

贴片机

SIPLACE

贴装头

CP20: 最高贴装速度

SIPLACE CP20 Placement Head - for highest speed

CPP: 出色的灵活性

SIPLACE CPP Placement Head - for maximum flexibility

TWIN VHF: 专用于大尺寸重型元器件贴装

SIPLACE TWIN VHF Placement Head - for large and heavy component handling

供料选件

SIPLACE华夫盘交换器

SIPLACE智能供料器

PCB 传送与顶针支撑

重载传送带

智能顶针支撑

编程系统

WORKS Programming
支持虚拟产品建构

WORKS Programming - with virtual product build ability

基于导入数据
定义元器件外行

Program component shape based on data import

图像处理系统

相机分类:

元器件相机
固定相机
PCB相机
共面度相机

机内检测功能

AI与HPC电子产品装配要求

零缺陷装配流程，需要对所有工序进行精准控制。
SIPLACE贴片机专为精准满足上述要求而设计，实现从取料到贴装的全流程管控。

HPC产品SMT生产工艺链

基于成熟技术，构建零缺陷装配工艺。

程序控制

微型元器件数量庞大，且BGA焊点结构复杂，为创建贴装程序带来极大挑战。

供料方案

智能元器件供料器和托盘装置，可保障物料稳定可靠供给。

质量控制

贴片机内置检测功能，可检验焊球尺寸、垫片位置、有无异物，以及元器件或物料模块板共面度、翘曲度。

创建贴装程序 PCB处理供料标准件帖装贴装位置检测异物检测 BGA拾取与贴装 BGA视觉及共面度检测

传送系统

超大尺寸电路板需实现稳定输送、可靠支撑与精准固定。

贴装头

既要完成数千个微型元器件精准角度、精准位置的贴装，也需实现超大超重BGA元器件的零缺陷贴装。

点击上方工艺步骤，查看对应详细方案。

复杂高密度电路板的编程方案

零缺陷装配工艺，从编程开始。

编程与仿真

复杂布局定义

当前AI应用所需的处理器BGA，普遍具备数千颗焊球；新一代元器件焊球数量将突破20,000颗，且呈不规则排布，封装描述难度极大。

WORKS 软件套件优势：

面向工艺的离线编程
编程数据集中化管理
离线模拟虚拟生产步骤
支持ODB++格式数据导入
支持焊球描述信息导入
PCB正反面3D可视化，轻松完成顶针支撑编程

3D view of the PCB bottom side for defining support pin positions in WORKS Programming

通过PCB反面的3D视图，在WORKS编程软件中定义支撑顶针位置

WORKS编程软件图形界面内的PCB视图

Import of ball position data at the station or offline station

可在生产机台或离线工作站导入焊球位置数据

返回工艺流程下个工艺步骤 →

大尺寸、重型及厚型PCB处理能力

SIPLACE解决方案可实现全流程稳定加工大尺寸电路板。

PCB传送

重载传送带

SIPLACE贴片机搭载柔性传送选件，支持超大尺寸、重型及厚型PCB加工。

最大板重：10 kg
最大尺寸：1,520 × 560 mm
最大板厚：10 mm
可编程调控传送速度

Heavy-duty conveyor system for reliable transport and straight PCB positioning — 重载传送系统，保障PCB稳定输送，板体平直、定位精准

Automatic placement of support pins with continuous position monitoring — 支撑顶针自动布设，位置全程实时监测

PCB支撑

智能顶针自动支撑

为避免PCB在装配过程中出现弯曲、振动，需对板体进行可靠支撑。相较于人工布设方式，SIPLACE智能顶针支撑系统作业效率更高，可靠性大幅提升。

功能特点：

依据编程软件WORKS Programming的参数设定，自动精准定位顶针
3D可视化在编程阶段即可提前检测、避免与敏感元器件碰撞
所有顶针的位置与高度均被全程实时监测

返回工艺流程下个工艺步骤 →

全品类元器件供料方案

贴装从微型无源SMD (如016008M芯片)到大尺寸重型BGA的各类元器件，需要智能供料方案。

卷装供料

SIPLACE智能供料器

SIPLACE智能供料器是专为柔性生产环境设计的智能卷装供料模块。

非接触式数据与电力传输
免维护卷装供料模块
自动校准取料位置
自动补偿取料偏移
自动检测接料
自动学习步距
唯一ID，确保上料验证可靠
支持 1 mm步距

SIPLACE Smart Feeder (detail) — SIPLACE智能供料器：精准、智能、轻便、无线、免维护。

盘装供料

SIPLACE 华夫盘交换器 (WPC)

SIPLACE华夫盘交换器(WPC)是大型异形件供料的高效方案。

华夫盘交换器WPC的功能特点：

自动快速更换托盘
可实现托盘不间断补料
完整的上料验证与追溯

SIPLACE华夫盘交换器 (WPC)
规格	性能
占用供料器站位	30
华夫盘载具尺寸(长×宽×厚)	360 × 260 × 6 mm
华夫盘可用尺寸(长×宽×厚)	347 × 235 × 15 mm
存储容量	最高28个料托盘载具
含元器件WPC总高度	最高45 mm
托盘更换时间	约1.9秒 (层级1更换)

返回工艺流程下个工艺步骤 →

高速贴装标准件

ASMPT贴装头是实现标准件高性能、出色灵活性贴装的核心部件。

SIPLACE 贴装头可实现卓越的贴装精度，具有先进的工艺控制功能：

器件在位检测
取料前偏移补偿
吸嘴尖端污染检查
元器件高度测量
采用软件控制的可编程贴装工艺，精准调控贴装压力

High-speed placement of standard components

卓越的速度

CP20贴装头

CP20适用于SMT产线前段标准件高速贴装，是理想的收集贴装头。

20个独立分段式旋转头，支持偏移校正与全角度贴装
元器件专属成像参数，可在单次贴装头旋转周期内，实现任意角度的高密度贴装
可对016008M规格至 8.2 x 8.2 mm尺寸元器件实现超高速贴装
精准监测Z轴位移，完成PCB翘曲变形补偿

出色的灵活性

CPP贴装头

CPP贴装头可依据软件指令，在三种不同贴装模式间自如切换。

单款贴装头集成高速贴装能力与宽泛元件适配范围，可优化产线平衡，消除生产瓶颈
支持收集贴装、拾取贴装、混合贴装模式
收集贴装模式下，可贴装最大尺寸 27 x 27 mm的元器件
拾取贴装模式下，同一贴装头可贴装最大尺寸 40 x 50 mm的元器件

返回工艺流程下个工艺步骤 →

贴装后元器件的验证

贴装高价值BGA前，必须确认下方元器件是否在位，并验证其贴装精度。

机内质量管控

视觉检测

SIPLACE贴片机配备高性能PCB相机，可检测已贴装元器件。

检测项目：

元器件在位检测/absence
检查元器件贴装位置是否在规定公差内

检测位置：

贴装完成后，直接在机内检测
在同一贴片机内、后续元器件贴装前开展检测

HPC应用案例：

通常在BGA下方贴装垫片(薄圆片)
防止连锡短路：维持元器件底部最小间隙，避免BGA边角翘曲引发短路
垫片贴装后，需核查其是否在位、位置是否正确
只有验证合格后，方可进行BGA贴装

Microscope picture of BGA after reflow with solder balls and spacer — 回流焊后BGA显微成像：焊球及垫

无刚性支撑垫片

Reason for spacer placement (no non-collapsing spacer)

垫片贴装的作用原理

加装刚性支撑垫片

返回工艺流程下个工艺步骤 →

Detection of foreign objects in the placement area

Tens of thousands of solder balls with diameters of 0.5 to 0.6 mm and pitch values ranging from 0.8 to 1.0 mm make BGA placement a critical process. It is essential to ensure that no foreign objects are present in this area.

DETECTING FOREIGN OBJECTS

Avoiding defects

SIPLACE placement machines feature high-resolution inspection for maximum reliability.

Inspection with the PCB camera before component placement in predefined areas, e.g. under shields or BGAs
Immediately before placing critical components, the system checks that no foreign objects are present in the target placement position
On-demand inspection capability
Inspection area of up to 175 × 175 mm
Software option: On-Board PCB Inspection

Detection of foreign objects with On-Board PCB Inspection

On-Board PCB Inspection for foreign object detection

On-Board PCB Inspection in placement machine

Back to process chain Next process step →

Secure handling of large and high-value BGAs

The pickup and placement of the BGA is the final step in the assembly of HPC server boards. A combination of a high-performance placement head, specialized nozzles, and precise process control ensures reliable results.

BGA MASTERING

Placement Head TWIN VHF

The Placement Head TWIN VHF (Very High Force) is designed for particularly large and unusually shaped components.

Placement of components up to 175 × 175 mm
Placement of components with a weight up to 650 g
Individual control and programming of all axes
A wide range of special nozzles and grippers for nearly any component shape
Keep-out areas (e.g. on top of processor units) are considered during nozzle design

Illustration of next-generation AI accelerator (combining one CPU and two GPUs) © NVIDIA

The Placement Head TWIN VHF opens up new possibilities in the assembly of complex BGAs

Special nozzle for pickup on the outer ring only

Illustration of a co-packaged optics (CPO) component for high-speed switches

Back to process chain Next process step →

Ensure reliable solder paste connection for High‑Density BGAs

Between pickup and placement of the BGA, vision-based inspections ensure an error-free final process stage.

VISUAL INSPECTION

Inspection of BGA

Visual inspection has become even more important with the new generation of BGAs.

SIPLACE high‑resolution cameras provide all required inspection capabilities for complex components.

Six illumination angles combined with feature‑based algorithms ensure reliable and repeatable inspection results.

Reliable vision detection of 50,000+ solder balls
Potential vision checks:
- Missing or defective connections
- Incorrect ball size
- Incorrect ball position
- Landside capacitors
- Barcode / Data Matrix code reading
- Verification of orientation marks
Measurement data and camera images can be saved and analyzed

BGA with high amount of balls and landside capacitors

COMPONENT CAMERA TYPE 56
Specification	Capability
Field of View	66 × 50 mm
Min. component size	0.2 × 0.2 mm
Max. component size	200 × 200 mm
Min. lead pitch	200 / 300 µm
Min. lead width	100 µm
Min. ball pitch	140 / 300 µm
Min. ball diameter	80 µm

COPLANARITY INSPECTION

All connections must be within reach

The 3D Coplan Module ensures that all connections come into contact with the solder paste.

Measurement principle:

Height profile measurement using laser triangulation
Calculation of the seating plane
Verification that all connections can be in contact with the solder paste
Inspection of 50,000+ solder balls

3D COPLAN MODULE
Specification	Capability
Component size	Up to 200 × 200 mm
Height resolution	0.5 µm
Min. lead pitch	300 µm
Min. lead width	100 µm
Min. ball pitch	400 µm
Min. ball diameter	200 µm

Result of 3D coplanarity measurement displayed at the station

3D coplanarity measurement of BGA in SIPLACE placement machine

Measurement principle: laser triangulation

Back to process chain First process step →

SIPLACE solutions for HPC manufacturing

Typical machine specification in a line for high performance computing

SIPLACE SX

High-performance platform for demanding SMT production with advanced process control and scalable configurations.

Designed for high throughput and precision
Flexible configuration options for line balancing
Process control features supporting complex assemblies

SIPLACE SX PLACEMENT MACHINE
Specification	SIPLACE SX2
Placement head	CP20 / CPP / TWIN / TWIN VHF
Component size max.¹	175 × 175 mm
Component weight²	up to 650 g
Feeder capacity	120 × 8 mm feeder
Tray Supply	Waffle Pack Changer non-stop refill
PCB size (L×W×H)	1,525 × 560 × 10 mm
PCB weight	up to 10 kg
Options:	Smart Pin Support
Options:	3D Coplan Module
Software:	On-Board PCB Inspection
Software:	OSC Package

¹ 240 × 240 mm available soon | ² Up to 2.0 kg available soon

View SIPLACE SX

SIPLACE X S

Compact and efficient solutions for flexible production environments, supporting a broad component range.

Optimized footprint for space-efficient lines
High flexibility for high-mix manufacturing
Reliable performance across standard SMT applications

SIPLACE X S PLACEMENT MACHINE
Specification	SIPLACE X4 S
Placement head	CP20 / CPP / TWIN
Component size max.	120 × 120 mm
Component weight	up to 160 g
Feeder capacity	160 × 8 mm feeder
Tray Supply	Waffle Pack Changer non-stop refill or matrix tray unit
PCB size (L×W×H)	850 × 685 × 10 mm
PCB weight	up to 10 kg
Options:	Smart Pin Support
Options:	3D Coplan Module
Software:	On-Board PCB Inspection
Software:	OSC Package

View SIPLACE X S

本技术指南梳理了人工智能及高性能计算类电子产品的组装核心要求，并详解 SIPLACE 贴装解决方案如何实现全流程可控的 SMT 生产，涵盖编程、元器件处理、检测及最终贴装等各个环节。

下载技术文档 (PDF)

AI服务器应用

助力高性能计算 (HPC) PCB制造

适用于HPC SMT生产卓越的贴片机内置解决方案

AI与HPC电子产品装配要求

HPC产品SMT生产工艺链

复杂高密度电路板的编程方案

大尺寸、重型及厚型PCB处理能力

全品类元器件供料方案

高速贴装标准件

贴装后元器件的验证

Detection of foreign objects in the placement area

Secure handling of large and high-value BGAs

Ensure reliable solder paste connection for High‑Density BGAs

SIPLACE solutions for HPC manufacturing

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