SMT话题聚焦
The increasing integration of semiconductor and electronics manufacturing is driven by the miniaturization, systems integration and rising performance demands of modern electronics
Today, advanced packaging technologies make it possible to build compact and powerful systems for applications such as smartphones, AI and HPC computing, 5G infrastructures, autonomous driving or IoT platforms by combining classic SMT components with complex semiconductor solutions such as chiplets, dies and heterogeneous integration approaches.
With our broad product portfolio, we cover semiconductor and electronics manufacturing applications, thus creating optimal conditions for putting the resulting synergies to use through innovative solutions.
The hybrid SIPLACE CA2 placement system, which can process SMDs from tapes and dies directly off singulated wafers, integrates the demanding die bonding process into the SMT line, making expensive special machines superfluous. Taking dies directly off the wafer also eliminates the expensive die taping process, which does not only reduce production costs but benefits the environment, because using a single SIPLACE CA2 avoids roughly 800 kilometers of tape waste in a 24/7 system-in-package production.
A supply system holding up to 50 different wafers with a changeover time of less than 13 seconds ensures exceptional component flexibility. The versatile machine, which is equipped with a single-lane or dual-lane conveyor, is prepared to handle state-of-the-art manufacturing processes for wafer-level packaging (WLP), panel-level packaging (PLP), embedded PCBs, system-in-package (SiP) modules, and power semiconductors, to name just a few.
More information about the SIPLACE CA2
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The state-of-the-art SIPLACE TX micron is designed for processing SMDs as well as dies from tapes. An individually programmable placement process with touchless pickup and zero-force placement as well as complete traceability from tape to finished product guarantee the highest level of quality – even for demanding mixed placement applications.
With a standard accuracy rating of 20 microns @ 3 sigma and optional accuracy classes of 15 and 10 microns @ 3 sigma, component pitches can be reduced to as little as 50 microns. And thanks to its impressive throughput rating of up to 50,000 components per hour, the SIPLACE TX micron can be seamlessly integrated into any high-speed electronics manufacturing line. Two SIPLACE head options, a multi-purpose dual conveyor for thick and severely warped circuit boards and for transporting JEDEC trays as well as the SIPLACE Tray Unit for the uninterrupted supply of components make the cleanroom-certified SIPLACE TX micron a versatile all-rounder.
More information about the SIPLACE TX micron
As the ideal basis for modern advanced packaging production, the highly flexible DEK Galaxy solder paste printer meets the needs of demanding applications with ultra-fine pads and small pitches. Its innovative platform allows for quick switching between different processes such as wafer bumping, the production of system-in-package (SiP) modules in singulated or strip formats, or ball attach on wafers or substrates with ball diameters of up to 0.2 mm.
In combination with integrated singulated substrate tooling systems from DEK, it is possible to precisely align multiple substrates within a single print cycle that gets completed in only seven seconds. Advanced features like these make the DEK Galaxy the ideal choice for high-speed and high-performance lines in advanced packaging production. The system achieves a wet-print accuracy of ±17.5 microns at >2.0 cpk (±6 sigma) – a decisive advantage for maximum precision and process stability.
In addition to the above, ASMPT Semiconductor Solutions offers a diverse portfolio of machines for applications ranging from bonding and molding to trimming and forming for the microelectronics, semiconductor, photonics and optoelectronics industries.
For more information on innovative advanced packaging solutions from ASMPT, visit ASMPT Semiconductor Solutions
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