SMT topics in focus
23.09.2024
With SMD components, there are always small deviations in height and the PCBs to be assembled are not always perfectly flat. These variables must be determined and taken into account during placement in order to ensure consistent placement quality at all times.
Our SIPLACE placement machines determine the component height and PCB warpage during the ongoing placement process:
• via component laser sensors and segment light barriers • via the measured placement height
The determined PCB profile is saved for ongoing production and thus compensates the offset for the next placement process.
The automatic detection of component height and PCB warpage compensates for quality fluctuations without manual intervention.
Your benefits:
Automatic compensation: SIPLACE placement machines deliver optimum placement quality for every PCB.
The automatic detection of placement height and PCB warpage has no negative impact on throughput.
… good to know!
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