SMT topics in focus
21.12.2025
In the age of advanced packaging and highly integrated SiP modules, the traditional dividing lines between semiconductor back-end manufacturing and SMT processes are increasingly blurring. ASMPT has platforms in its portfolio that take the production spectrum to this new level. In addition to the DEK Galaxy solder paste printer, these include the highly innovative SIPLACE TX micron placement platform and, above all, the groundbreaking SIPLACE CA2 hybrid placement platform, which sets completely new standards in the industry.
As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.