ASMPT at SEMICON Taiwan 2024

Fan-Out Packaging: Powering the AI Era 
The AI revolution continues to push the boundaries of computing power, driving the demand for high-performance AI chips, which in turn is accelerating innovation in advanced packaging. The fan-out process is shaping the future of semiconductor manufacturing, and ASMPT is at the forefront of this trend with its high-density Fan-Out Panel-Level Packaging (FOPLP) solution designed for 2.5D, fan-out, and embedded packages. NUCLEUS XLplus is precisely engineered to meet SEMI 3D20 standards, and it delivers exceptional accuracy on SiP bonding and flexibility in the fan-out process. Capable of handling extra-large substrates up to 600 x 600 mm, the solution supports a wide range of packaging configurations, from flip-chip to direct die attach, which exemplifies ASMPT’s dedication to pioneering technology and innovation in the rapidly evolving advanced packaging industry.

Smart Automotive Solutions: Driving the Future 
AI is widely adopted by electric vehicle manufacturers for advanced driver assistance systems, autonomous driving features, and predictive maintenance, enabling enhanced performance, safety, and efficiency. To meet the dynamic needs of the automotive sector, ASMPT will present a range of Smart Automotive solutions tailored for the industry, encompassing sensing tech, power management, connectivity, infotainment, and more. ASMPT will also present the SiC power and advanced display solution, empowering EV manufacturers to improve quality, reliability, and efficiency in their production operations. 
•    POWER VECTOR - a die-tacking solution designed for Ag/Cu sintering in automotive power modules, offering strong bonding forces up to 588 N and process versatility. Coupled with 
ASMPT’s SiC power solution, manufacturers can create robust modules with enhanced electrical and thermal characteristics. 
•    VORTEX II - designed explicitly for Mini LED Advanced Displays, efficiently handling Mini LED assembly and offering high-speed performance, exceptional precision, and innovative Zero-Delay XY-auto-correction, tending to transform visual experiences in modern vehicles with enhanced display quality and performances. 
 
Intelligent Factory: Elevating Digital Transformation to New Heights 
As the premier supplier of cutting-edge equipment and technological processes for the electronics industry, ASMPT enables electronics manufacturers worldwide to establish smart factories, championing automation and digitalisation. Through AI Enablement with machine learning algorithms incorporating the 4M framework (Man, Machine, Materials, Method), ASMPT solutions offer decision automation and optimisation, seamlessly integrating all operational levels from individual machines to production lines, factories, and enterprises. ASMPT’s comprehensive smart manufacturing solutions include SkyEye, the ecosystem for smart semiconductor manufacturing, and Intelligent Factory solutions, alongside its innovative SIPLACE placement and DEK printing solutions, as well as the modern Manufacturing Execution Systems (MES) from Critical Manufacturing will be displayed at SEMICON Taiwan. Together, this dynamic platform of advanced technologies will illustrate the latest automation and Digital Transformation advancements.  
 
"ASMPT's presence at SEMICON Taiwan 2024 reflects our commitment to leading the industry with our developments and providing innovative solutions for semiconductor and electronics manufacturing. ASMPT will showcase its latest innovations in advanced packaging, smart automotive solutions and smart manufacturing, highlighting its leading role in semiconductor and electronics manufacturing technology. This will further strengthen our collaboration with our customers and partners and reinforce our role as a trusted industry leader that increases productivity, efficiency and competitiveness, " reassures Joseph Poh Tson Cheong, Senior Vice President at ASMPT.