ASMPT at Productronica 2025

“For 50 years, the Productronica has been the leading global trade fair for our industry – a yardstick for technologies, markets, and the entire industry, which is largely driven by electronics manufacturing. It also offers a central platform for affirming the innovative strength and competitiveness of Europe in the increasingly consolidating semiconductor and electronics manufacturing sector. As the only supplier that covers the entire value chain from SEMI to SMT with integrated hardware and software solutions, we demonstrated in an impressive manner the key role ASMPT will play in tomorrow’s intelligent and sustainable manufacturing operations,” said Guenter Lauber, ASMPT CSO and SMT Segment Chairman. “The 2025 Productronica clearly exceeded our expectations. We were particularly pleased to see the enthusiasm with which many visitors from all over the world experienced our totally new SIPLACE V in action for the first time.”

Newly developed: The SIPLACE V

The SIPLACE V, which has been newly developed from the ground up, provides a significant performance boost for the intelligent factory. In key industries, it enables performance increases of up to 30 percent under demanding real-life production conditions. In a footprint of merely 1.1 by 2.4 meters, its optimized placement heads can assemble up to 105,000 components per hour with a precision of 25 µm @ 3 σ. Thanks to its broad component spectrum, which ranges from 016008M chips to large BGAs and OSCs, it offers the widest possible scope of applications. And since the future-oriented architecture of the SIPLACE V opens up generous performance reserves for future automation and AI functions, it also provides long-term investment protection – all while being fully compatible with existing hardware and software solutions from ASMPT.

Award winner: The SIPLACE CA2

With its SIPLACE CA2, ASMPT demonstrated at the Productronica how placement technology and semiconductor manufacturing can be combined in an intelligent solution. The hybrid placement platform processes both taped SMDs and dies taken directly off the sawed wafer in a single process step, thus making the entire die taping process superfluous – an advantage that reduces costs and minimizes waste significantly. The machine’s forward-looking concept also impressed the jury of the Global Technology Awards, which honored the hybrid platform with one of its prestigious prizes.

Growth market: Advanced packaging

The trade audience was equally impressed by two highly innovative precision bonders at the ASMPT booth. With this MEGA multi-chip bonding solution, ASMPT is opening up a new class of chip placement precision and productivity in semiconductor production. The MEGA, which performs tasks that used to require an entire machine line, is ideally suited for forward-looking applications in the areas of AI, smart mobility, and hyperconnectivity.

For the production of co-packaged optics, ASMPT presented the ultra-precise AMICRA NANO die and flip-chip bonder. The platform combines placement accuracy in the sub-micrometer range with eutectic high-speed AuSn bonding, making it possible to reliably manufacture highly miniaturized opto-electronic components that execute the transition between optical and electrical signal processing. They are essential for modern data centers and networks that require energy-efficient and powerful data transmission with minimal latency.