Meeting ASMPT at SEMICON India 2024

“As a leading manufacturer of semiconductor equipment, we also aim to proactively shape the future of the Indian semiconductor industry, together with our local customers”, promises Glenn Siew, Senior Sales Manager at ASMPT. “We are fully focused on the needs of local chip manufacturing and look forward to showcasing our innovative products and concepts at SEMICON India's debut.”
India's semiconductor industry is experiencing rapid growth, driven by escalating demands in smartphone, automotive, and data storage sectors, bolstered by government support. Projections  indicate that India's semiconductor market is poised to reach $150 billion by 2030, a significant increase from $33 billion in 2023, showcasing an impressive CAGR of 24%.
The ASMPT booth will feature cutting-edge assembly and packaging equipment, highlighting the INFINITE die bonder and the Eagle AERO wire bonding system.
•    INFINITE: Designed for 12-inch wafer processing, ensures precise chip placement and optimal bond line thickness (BLT) for various packaging types, meeting industry accuracy standards.
•    Eagle AERO: Enhances productivity by up to 30% compared to traditional methods, with efficient error handling and patented bonding technology for precise bonds at reduced pressure and temperature. Supports small ball sizes and seamless smart factory operation with ASMPT's SkyEye technology.
“SEMICON India 2024 is the ideal platform for us to convince local semiconductor manufacturers of our market-leading products and our comprehensive solution expertise," says Glenn Siew. “Discover how our solutions integrate seamlessly into your production facilities. We look forward to talking to you personally at booth H1V01.”