SMT topics in focus
13.01.2026
Singapore, January 13, 2026 – With the shared objective of addressing the rapidly growing advanced packaging market through innovative, state-of-the-art technologies, ASMPT SMT Solutions have entered into a cooperation agreement with Shinwa Co., Ltd. in Japan to offer a full ASMPT SMT products and solutions portfolio. The partnership will be highlighted at NEPCON Japan from January 21 to 23, 2026, where cutting-edge SIPLACE placement solutions will be exhibited at the Shinwa booth (East Hall 5, Booth E12-16, Tokyo Big Sight).
At NEPCON Japan, Shinwa will present itself as a comprehensive equipment provider for the semiconductor and electronics industries. Alongside its own precision dispensing systems, solder paste solutions, solder joint inspection equipment and advanced packaging technologies, the company will showcase world-leading placement technology from ASMPT SMT Solutions.
Semiconductor and SMT manufacturing converge
Recently honored with a Global Technology Award, ASMPT’s hybrid placement solution SIPLACE CA2 combines semiconductor and SMT processes in a single machine, addressing the growing demand for integrated manufacturing concepts. SIP (System-in-Package) production is seamlessly integrated directly into the SMT line: in a single process step, the system handles both tape-and-reel SMD components and dies directly from sawn wafers. Performance reaches up to 54,000 dies or 76,000 SMT components per hour, with placement accuracy of up to 7 µm @ 3 σ.
Another ASMPT placement solution that will be shown on the booth is the SIPLACE TX micron, a placement platform developed specifically for demanding advanced packaging and high-density applications. Combining placement accuracy of up to ±10 µm with a maximum output of up to 93,000 components per hour, the machine is ideally suited to highly complex and precision-critical production environments.
Visitors can also find out more about ASMPT’s DEK TQ portfolio of solder paste printers, including new automation features such as the DEK TQ GO automatic stencil exchange system.
A partnership driven by collective strength
With its established sales and support network throughout Japan and its strong strategic and technological fit with ASMPT's products and solutions, Shinwa Co., Ltd. is the ideal business partner for ASMPT. The automotive industry is one of Shinwa’s most important customer segments, and there is strong potential to provide assembly solutions for the advanced electronics needed in this market. Shinwa's extensive experience in factory automation complements ASMPT SMT Solutions' commitment to driving digital transformation towards the intelligent factory perfectly.
As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.