SIPLACE X S

Maximum capacity for an intelligent factory

Tailor-made for your production, the SIPLACE X S is the machine of choice for demanding high-volume applications. Robust placement heads and intelligent feeders ensure an extremely fast placement process while smart sensors and a unique digital vision system provide maximum precision and process reliability. Innovations like fast and precise PCB warpage detection complete the overall package.

The SIPLACE X S is the perfect solution for telecommunication/5G, IT/server and other demanding applications where you want to be a step ahead of the competition with non-stop processes, maximum yields, extreme productivity, and the lowest placement costs.

Modular, flexible, open – Standard interfaces and a growing number of automation options make the SIPLACE X S the number one choice for your demanding high-volume production applications in the intelligent factory.

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TELESTE

High quality along the line

As a leader in broadband, security and information technology, Teleste manufactures products that are highly critical in terms of safety and user success. Accordingly, delivery reliability and a consistently high level of quality are among the standards that Teleste sets throughout the industry. The increasing need for flexibility in the company’s high-mix/low-volume production, especially in the area of solder paste printing, proved to be a key challenge, with the goals being to automate quality assurance and offset correction, reduce the scrap rate, and maximize overall uptime.

Since upgrading to the latest technology from ASMPT, our production runs faster, more effectively, and more transparently. We raised our output while reducing the number of manual assists. The positive feedback from our customers and the low reject rates confirm to us every day that we are on the right track, also in terms of quality assurance.

Aki Enberg (l.), SMT process developer at Teleste

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SIPLACE X S at a glance

Performance combined with flexibility and large PCB capability plus highest placement quality
Highest performance or feeder count per head machine available with 4, 3, or 2 gantries with placement head
Single conveyor with optional PCB width up to 680 mm and weight up to 8 kg
Best placement quality with closed-loop processes, digital vision system, automated PCB warpage compensation and linear motors for lowest DPM rates
Suitable for low, medium, and high-speed applications based on head and line configuration
Energy-saving: E-Car inspired power supply concept, kinetic energy recovery, and air consumption off when idle
SIPLACE X Feeders: Accurate, intelligent, interactive, lightweight, wireless, and maintenance-free
Faster new product introduction with self-teach and NPI capabilities, plus off-line programming for the fastest and easiest setup
Software capabilities & IT integration: Seamlessly integrate SIPLACE software with third-party systems

	X4S	X3S	X2S
Placement speed	150,000	112,500	75,000
Placement accuracy	up to 25 µm	up to 25 µm	up to 25 µm
PCB dimensions (L x W)	450 x 685 mm single-track conveyor 450 x 320 mm dual-track conveyor 450 x 600 mm dual as single-track conveyor up to 800 mm long board option
Feeder capacity	160
Machine dimensions (L x W x H)	1948 x 2647 x 1630

M2M communication interfaces: IPC-HERMES-9852, WORKS Operations Information Broker, IPC-CFX
WORKS Software Suite: In combination with WORKS Software Suite applications, you can automate process optimization, material supply and operator control operations as well as program changeovers during product changes.
SMT Analytics: In-depth analysis software for improving assembly throughput rates and lowering manufacturing costs by recognizing even hard-to-pinpoint deficits.

CP20 Head – for maximum accuracy and speed:
- For the smallest, most sensitive components ranging from 0201 metric to 8.2 mm × 8.2 mm and 4 mm (L × W × H)
- Extremely fast: Up to 43,000 cph
- Extremely accurate: Up to ±34 μm @ 3 σ
- Placement force from 0.5 N to 4.5 N
- Touchless pickup and zero-force placement.
CPP Head – for maximum flexibility:
- For components from 01005 to 50 mm × 40 mm and 15.5 mm height
- Speed of up to 23,500 cph
- Accuracy of up to ±30 μm @ 3 σ
- software-controlled switching between pick & place, collect & place, and mixed mode
- enables a perfectly balanced line even with fast product changeovers – no time-consuming configuration and head changes
Twin Head – for maximum force:
- Places components ranging from 0201 metric to 200 × 150 × 25 mm (L × W × H)
- Speed: Up to 5,500 cph
- Accuracy: Up to ±26 μm @ 3 σ
- Placement force: 1.0 N to 30 N
- - component weight up to 300 g (TWIN VHF version)
- Snap-in detection and 3D measurement in real time
3D Coplanarity Sensor: Detects faulty components for optimal process control
SIPLACE MeasuringFeeder: Precise measurement and fast verification of components to avoid incorrect placements and improve process reliability
SIPLACE Glue Feeder: Automated adhesive application for reliable component fixation and improved process reliability
Linear Dipping Unit (LDU): Efficient dipping and placement, also suitable for small volumes and multi-die applications
SIPLACE PowerConnector
SIPLACE Smart Pin Support: Automated placement of support pins
WPC5/WPC6: Non-stop supply of components in trays
MTC Flexible supply system for JEDEC trays
OSC Package: Software and hardware solutions for placing large and heavy odd-shaped components
Thick Board Option: For board thicknesses up to 6,5 mm
On-board PCB Inspection: Solder paste, pre-placement and post-placement inspection for zero DPM production
Smart Nozzle Reader: Detects smart nozzles with unique IDs for optimal process control

Performance combined with flexibility and large PCB capability plus highest placement quality
Highest performance or feeder count per head machine available with 4, 3, or 2 gantries with placement head
Single conveyor with optional PCB width up to 680 mm and weight up to 8 kg
Best placement quality with closed-loop processes, digital vision system, automated PCB warpage compensation and linear motors for lowest DPM rates
Suitable for low, medium, and high-speed applications based on head and line configuration
Energy-saving: E-Car inspired power supply concept, kinetic energy recovery, and air consumption off when idle
SIPLACE X Feeders: Accurate, intelligent, interactive, lightweight, wireless, and maintenance-free
Faster new product introduction with self-teach and NPI capabilities, plus off-line programming for the fastest and easiest setup
Software capabilities & IT integration: Seamlessly integrate SIPLACE software with third-party systems

	X4S	X3S	X2S
Placement speed	150,000	112,500	75,000
Placement accuracy	up to 25 µm	up to 25 µm	up to 25 µm
PCB dimensions (L x W)	450 x 685 mm single-track conveyor 450 x 320 mm dual-track conveyor 450 x 600 mm dual as single-track conveyor up to 800 mm long board option
Feeder capacity	160
Machine dimensions (L x W x H)	1948 x 2647 x 1630

M2M communication interfaces: IPC-HERMES-9852, WORKS Operations Information Broker, IPC-CFX
WORKS Software Suite: In combination with WORKS Software Suite applications, you can automate process optimization, material supply and operator control operations as well as program changeovers during product changes.
SMT Analytics: In-depth analysis software for improving assembly throughput rates and lowering manufacturing costs by recognizing even hard-to-pinpoint deficits.

CP20 Head – for maximum accuracy and speed:
- For the smallest, most sensitive components ranging from 0201 metric to 8.2 mm × 8.2 mm and 4 mm (L × W × H)
- Extremely fast: Up to 43,000 cph
- Extremely accurate: Up to ±34 μm @ 3 σ
- Placement force from 0.5 N to 4.5 N
- Touchless pickup and zero-force placement.
CPP Head – for maximum flexibility:
- For components from 01005 to 50 mm × 40 mm and 15.5 mm height
- Speed of up to 23,500 cph
- Accuracy of up to ±30 μm @ 3 σ
- software-controlled switching between pick & place, collect & place, and mixed mode
- enables a perfectly balanced line even with fast product changeovers – no time-consuming configuration and head changes
Twin Head – for maximum force:
- Places components ranging from 0201 metric to 200 × 150 × 25 mm (L × W × H)
- Speed: Up to 5,500 cph
- Accuracy: Up to ±26 μm @ 3 σ
- Placement force: 1.0 N to 30 N
- - component weight up to 300 g (TWIN VHF version)
- Snap-in detection and 3D measurement in real time
3D Coplanarity Sensor: Detects faulty components for optimal process control
SIPLACE MeasuringFeeder: Precise measurement and fast verification of components to avoid incorrect placements and improve process reliability
SIPLACE Glue Feeder: Automated adhesive application for reliable component fixation and improved process reliability
Linear Dipping Unit (LDU): Efficient dipping and placement, also suitable for small volumes and multi-die applications
SIPLACE PowerConnector
SIPLACE Smart Pin Support: Automated placement of support pins
WPC5/WPC6: Non-stop supply of components in trays
MTC Flexible supply system for JEDEC trays
OSC Package: Software and hardware solutions for placing large and heavy odd-shaped components
Thick Board Option: For board thicknesses up to 6,5 mm
On-board PCB Inspection: Solder paste, pre-placement and post-placement inspection for zero DPM production
Smart Nozzle Reader: Detects smart nozzles with unique IDs for optimal process control