SMT topics in focus
for Power Module Assembly
ASMPT offers everything that is needed to build a modern and efficient power module manufacturing line from a single source: from wafer separation, printing, curing, die & module tacking, sintering to encapsulation.
ASMPT Solutions:
Die Tacking Solution for Ag / Cu Sintering
ASMPT will present for the first time to a European audience its innovative die and module bonding platform POWER VECTOR, which is ideally suited for both processes.
The machine features bonding forces of up to 588 N and accommodates all popular processes: dry paste, wet paste, and die transfer film (DTF).
Components can be supplied via wafer, tape-and-reel, waffle pack, or tray.
Highlight features:
Wafer Separation / Multi-Beam Laser Dicing
With the ALSI LASER1205 laser dicing platform and the patented V-DOE, users can reduce their loss rate when processing highly sensitive SiC wafers and improve their quality (e.g. die strength) while lowering their cost of ownership.
The innovative system processes wafers ranging from 10 to 250 microns in thickness with a positioning accuracy of less than 1.5 microns, all while being 50 percent faster than traditional methods.
Our event team is there for you! We are at your side and support you you with all questions concerning your visit at the ASMPT booth and afterwards.
Contact us
As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.