SIPLACE OSC Package

With SIPLACE equipment, the perfect interaction between placement head and vision system makes it easy to master the challenges posed by OSCs.

• Placement forces of up to 100 N
• Snap-in recognition
• Real-time 3D measurement of contact pins
• Automatic placement speed optimization
• Automatic illumination setting for OSC components
• Crack detection -Component cracks can be identified via the PCB camera inspection prior to pick up as shown in the pictures (i.e. at bare dies)
• Component weight up to 300 g 
• NEW: Measure moment of inertia