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SMT topics in focus

Interaktives eMagazin
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SMT topics in focus

Interaktives eMagazin
WORKS

ASMPT successful at INTERNEPCON JAPAN

06.02.2023

Advanced packaging – enabled by Open Automation

ASMPT, a leading maker of hardware and software for semiconductor and electronics production, further expanded its customer and business contacts at Asia’s leading exhibition for research and development, electronics and manufacturing as well as packaging technologies. The main focus at the ASMPT booth was on advanced packaging under the banner of the company’s Open Automation concept for the automotive sector.

After the COVID gap, trade fairs have been back full-force. From January 25 to 27, companies from all over the world presented their products and solutions at the INTERNEPCON JAPAN 2023 trade fair. ASMPT was represented with its own booth, where it welcomed numerous visitors showing great interest in purchasing and investing.

In the open-plan exhibition area, industry visitors could examine the automatic XFINITE epoxy die bonder for 12-inch wafers along with 0201m demo boards on the subject of high-density placement. A tabletop display provided information about WLFO. Other highlights included the SIPLACE TX micron and SIPLACE CA placement systems as well as sintering systems, clip bond, and other power packages. Many visitors took advantage of the opportunity to engage in personal technical discussions with ASMPT's experts. Many decision makers showed deep interest in ASMPT’s way of combining the two worlds of semiconductor and SMT production in one innovative and powerful machine. The new SIPLACE CA processes SMT components and dies directly from the diced wafer with die-attach and flip-chip processes in the same work step – with tremendous speed and accuracy.

Restructuring as a growth driver

“The entire automotive sector is currently undergoing a profound restructuring, not only in powertrain technology,” explained Yuzo Ishizaki, General Manager at ASMPT SMT Japan. “Our customers in this industry in particular are showing great interest in innovative advanced packaging solutions for things like SiP and power modules. True to our Open Automation concept, we offer for this technology very fast, highly precise, process-stable and integration-capable production machines that give manufacturers the freedom to choose the extent to which they want to automate their operations at any time.”

Best-in-class solutions

As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.

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