Empowering the Future of AI and Semiconductor Manufacturing

From September 10 to 12, 2025, SEMICON Taiwan 2025, Asia's premier annual semiconductor event, was grandly held at the Taipei Nangang Exhibition Center. As a global leader in hardware and software solutions for semiconductor and electronic product manufacturing, ASMPT showcased cutting-edge technologies and innovative concepts at the exhibition. Focusing on the in-depth integration of artificial intelligence (AI) and intelligent automation in the field of semiconductor manufacturing, ASMPT demonstrated to the industry how technological breakthroughs can drive semiconductor manufacturing into a new phase of "faster, smarter, and more scalable", injecting strong impetus into the innovative development of the global semiconductor industry.

In the Surface Mount Technology (SMT) Solutions Zone of this exhibition, ASMPT's flagship product, the SIPLACE CA2, became the highlight of the entire event. With its disruptive technical design, it attracted a large number of professional visitors to stop and inquire. This equipment has made a breakthrough in integrating the two core functions of "high-speed chip assembly directly from wafers" and "SMT placement" into one unit. It condenses the processes that originally required multiple devices to complete step by step into a single machine. This not only significantly reduces the equipment floor space in the production process and the time for process connection, but also fundamentally minimizes the risk of chip damage and precision deviation caused by the transfer between multiple devices.

In terms of technical parameters and practical application value, the advantages of the SIPLACE CA2 are particularly prominent. Its high-speed chip assembly function is compatible with wafers of current mainstream sizes, enabling precise picking and positioning of multiple chips per second, with placement accuracy controlled at the micron level. This perfectly meets the strict manufacturing precision requirements of precision semiconductor devices such as AI chips and high-end processors. At the same time, the equipment is equipped with an intelligent visual recognition system and a real-time data monitoring module, which can dynamically capture subtle deviations in the production process and automatically adjust parameters, raising the production yield to a new level. An engineer from a world-renowned electronic manufacturing enterprise at the scene stated, "The integrated design of the SIPLACE CA2 solves the efficiency and precision problems we face in high-end chip manufacturing. If applied in mass production, it is expected to increase the overall production capacity of the production line by more than 20%, which is crucial for meeting the current strong market demand for AI chips."

Beyond the impressive product displays, ASMPT's team of technical experts also held multiple in-depth exchange seminars with customers and industry partners during the exhibition, sharing cutting-edge insights on core pain points and future trends in the semiconductor manufacturing field. On the topic of "Intelligent Process Control", the experts proposed a real-time process optimization solution based on AI algorithms. By embedding multi-dimensional sensors in production equipment to collect key production data such as temperature, pressure, and speed, and then using machine learning models to conduct real-time analysis of the data, potential process anomalies can be predicted in advance. This realizes the transformation of the production management model from "post-event remedy" to "pre-event prevention". This solution has achieved remarkable results in pilot applications at some cooperative enterprises, reducing the incidence of process anomalies by 35% and saving enterprises a significant amount of production costs.

Regarding the topics of "advanced packaging" and "automation empowering AI implementation", which are highly concerned by the current semiconductor industry, the ASMPT team put forward unique perspectives based on industry practices. As AI chips develop towards the direction of "high computing power, high density, and small size", traditional packaging technologies can no longer meet the demand. ASMPT's proposed Chiplet packaging solution can integrate and package bare chips with different functions through advanced interconnection technologies. While improving chip performance, it also reduces R&D costs and manufacturing difficulties. In the field of automation, ASMPT emphasizes the importance of a "full-process automated closed loop". From wafer dicing and chip placement to final inspection, through the seamless connection between automated equipment and digital management systems, full-process traceability ob production data and cross-process collaboration are realized, building a stable and efficient implementation carrier for the large-scale application of AI technology in semiconductor manufacturing.

As an important exchange platform for the global semiconductor industry, SEMICON Taiwan 2025 has once again confirmed the core value of "collaboration and innovation" in promoting industry development. ASMPT's participation in this exhibition not only demonstrated its profound accumulation in technology R&D and solution design, but also built a cooperation bridge for technology sharing and demand connection through in-depth interactions with industry partners. During the exhibition, ASMPT has reached preliminary cooperation intentions with a number of semiconductor manufacturing enterprises from Mainland China, Taiwan Region of China, and Southeast Asia. In the follow-up, further cooperation will be carried out in areas such as intelligent production upgrading and the application of advanced packaging technologies to jointly promote the high-quality development of the semiconductor manufacturing industry.

Jay Zhu, Senior Manager of Product Marketing of ASMPT said, "SEMICON Taiwan 2025 is a grand event that gathers industry wisdom. We are honored to participate in it and explore the future path of the integration of AI and semiconductor manufacturing with global peers. In the future, ASMPT will continue to deepen technological innovation, empower global semiconductor manufacturers with solutions that better meet industry needs, help the industry break through technical bottlenecks, and gain a competitive edge in the global competition of the AI era."

By the closing of the exhibition, ASMPT's booth had received a total of over 10,000 professional visitors and hundreds of cooperation inquiries and technical exchange requests. This participation not only consolidated ASMPT's leading position in the field of semiconductor manufacturing solutions but also laid a solid foundation for its subsequent expansion of the global market and deepening of industry cooperation.