SMT topics in focus
28.10.2024
Single-thickness stencils designed for mass imaging on non-flat surfaces and complex geometries, DEK Electroform 3D stencils enables efficient one-pass printing and are ideal for applications such as printing inside cavities and cover printing on pre-populated substrates.
Higher Throughput and ROI
3D stencil printing offers higher throughput compared to traditional dispensing processes, significantly increasing the return on investment (ROI) for stencil printers. By enabling paste deposition that was previously only possible with dispensing technology, manufacturers can achieve more efficient operations.
A specially supplied slotted squeegee is used in 3D stencil printing. This squeegee features slits that are more compliant, allowing them to bend and fit into and out of cavities. This design enables the squeegee to push paste into the stencil cavity and effectively wipe the paste out to complete the printing process.
Our Electroform Application Engineers are committed to helping our customers achieve the highest print quality and throughput. For more information on our DEK Electroform 3D stencils and to discuss on stencil designs to meet your requirements, contact us at sgstencils@asmpt.com
As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.