A new era: The SIPLACE V platform The SIPLACE V platform is a new design from the ground up. It features an innovative machine frame, highly efficient linear drives, and measurement systems with improved resolutions that enable significantly higher accelerations and more precision, forming the basis for significant improvements in real-life performance. In sectors that are particularly critical for the electronics industry such as automotive, consumer electronics, smartphones, IT and networking technology, the SIPLACE V makes it possible for users to achieve performance improvements of up to 30 percent under realistic production conditions. Initial field tests already confirm that the new placement platform delivers this performance increase not only in theoretical benchmarks, but in particular under real production conditions characterized by a broad product spectrum, frequent product changeovers, high variant diversity, and demanding process requirements. ”After some 25,000 assembled flat modules and 7.3 million components placed, we can confirm that the field test of the SIPLACE V platform in our high-mix, low-volume production was a complete success. The new placement machines from ASMPT are once again setting new standards in terms of performance, flexibility, quality and effective placement output,” says Martin Zistler, Vice President, Global Engineering at Zollner Elektronik AG. New generation of placement heads A central part of the SIPLACE V platform’s performance boost is the advancement in ASMPT’s placement head technology. By achieving a speed of up to 52,500 components per hour with a precision of 25 µm @ 3 σ, the SIPLACE CP20 collect-and-place head sets a new standard in high-speed applications. The highly flexible CPP head can switch between collect-and-place, pick-and-place and mixed modes based on software commands. This versatility makes it ideal for complex mixed-assembly applications in which it processes up to 28,000 components per hour with placement forces of up to 15 newtons. The SIPLACE TWIN VHF head is designed for particularly large and unusually shaped components. It processes components measuring up to 200 × 150 × 28 millimeters and up to 100 newtons reliably and with maximum precision. With a capacity to handle up to 6,000 components per hour, it opens up new possibilities for manufacturers in areas like the assembly of complex components such as BGAs, which play an increasingly important role in AI applications. Maximum flexibility even in the high-speed segment With the SIPLACE V platform, ASMPT SMT Solutions is setting new standards in terms of productivity and flexibility. It masters the full component spectrum – from ultra-miniature 016008M chips to large-format parts – and demonstrates its strengths particularly in the placement of complex or unusually shaped components. A universal head interface allows for the speedy exchange of placement heads even while the SIPLACE V keeps running. It is available in single-gantry and dual-gantry versions and can be configured with single-track or dual-track conveyors. A 3D coplanarity module, which checks components and circuit boards for warping and ensures secure assemblies even at top speeds, is optional. It is supplemented by additional cameras that ensure even more precision in special applications. The platform also accommodates a broad spectrum of PCB formats. With the dual conveyor, it processes boards measuring up to 400 × 280 millimeters, and with the single conveyor even boards measuring up to 700 × 530 millimeters. In addition, up to two tray units can be attached to each machine. Another highlight is the significantly increased number of feeder slots irrespective of previously installed options like the Smart Pin Support, whose pins are picked up by the placement heads, eliminating the need for a separate pin picker. ASMPT SMT Solutions combines all these features in a footprint of only 1.1 × 2.4 meters, which sets a new floorspace productivity record in electronics manufacturing. Proven quality, future-proof investment ASMPT relies on the proven quality characteristics of the SIPLACE series and advances them with its new platform. Functions like individually rotatable nozzle segments, which are unique in the industry, individual component inspection and seamless traceability continue to be part of each machine’s basic configuration. They are complemented by high-resolution cameras that ensure even more accuracy in the assembly process. Another major contributor to ASMPT’s legendary process reliability is its closed-loop sensor technology, which scans component heights and PCB profiles in real time and adapts placement forces automatically. This ensures that the placement quality stays consistently high even under high cycle rates. Compatibility and investment protection The new SIPLACE V platform fits seamlessly into the current portfolio of ASMPT SMT Solutions. Existing hardware components such as feeders or cameras can continue to be used without restrictions. Likewise, all applications from the comprehensive software world of ASMPT SMT Solutions are fully compatible, ranging from the station software to the applications of the WORKS Software Suite and Factory Solutions. “Our new SIPLACE V platform fits seamlessly into existing line concepts,” explains Thomas Bliem, Vice President R&D at ASMPT SMT Solutions. “This enables electronics manufacturers to modernize their production environments step by step and with full investment protection. At the same time, the platform is designed to offer ideal conditions for future automation steps and AI-based applications already today.”