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SMT topics in focus

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SMT topics in focus

PCIM Expo 2025

The leading trade fair and conference for power electronics, intelligent drive technology, renewable energy, and energy management will start soon. Come see us there.

These topics will be shown on our booth 145 in hall 6

Complete Process Solutions

for Power Module Assembly

ASMPT offers everything that is needed to build a modern and efficient power module manufacturing line from a single source: from wafer separation, printing, curing, die & module tacking, sintering to encapsulation.

ASMPT Solutions:

  • DEK NeoHorizon: The stencil printer for semiconductor, hybrid and high-end SMT applications
  • POWER VECTOR: The die, clip and component tacking tool for sintering with silver
  • SilverSAM: The sintering platform for power electronics
  • 3GeP: The universal transfer molding system for a wide range of packaging requirements

POWER VECTOR

Die Tacking Solution for Ag / Cu Sintering

ASMPT will present its innovative die and module bonding platform POWER VECTOR, which is ideally suited for both processes.

The machine features bonding forces of up to 588 N and accommodates all popular processes: dry paste, wet paste, and die transfer film (DTF).

Components can be supplied via wafer, tape-and-reel, waffle pack, or tray.

Highlight features:

  • Heated BH with high BF for die bonding on substrate
  • Ag film handling (film stamping)
  • Light BF pick head for die pickup
  • Heated WH (max 140×340mm)

ALSI LASER1205

Wafer Separation / Multi-Beam Laser Dicing

With the ALSI LASER1205 laser dicing platform and the patented V-DOE, users can reduce their loss rate when processing highly sensitive SiC wafers and improve their quality (e.g. die strength) while lowering their cost of ownership.

The innovative system processes wafers ranging from 10 to 250 microns in thickness with a positioning accuracy of less than 1.5 microns, all while being 50 percent faster than traditional methods.

Highlight features:

  • Full cut dicing or grooving
  • Thin Si MOSFET & IGBT
  • SiC MOSFET & IGBT
  • GaN on Si or SiC
  • UNIQUE: V-DOE: reduced Heat Affected Zone (HAZ) to improve die strength

Get your free ticket.

We look forward to seeing you at the PCIM Expo 2025 show.
Getting your free ticket is easy:


Step 1: Your free ticket number

Get your free ticket number via e-mail. Just enter your name and e-mail address:

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Step 2: Get your personal ticket

Follow this link to the official PCIM Expo 2025 website, enter the ASMPT ticket number and follow the instructions to order your personal ticket.

Step 3: Check your e-mail and print your ticket

Your personal ticket, which is good for all three show days, will arrive via e-mail. Simply print it out and bring it with you to the show.

At the PCIM Expo 2025

You can also get a free ticket at the show. Just request our personal ASMPT ticket number, bring it to the show, and register at the check-in desk.

You still have questions?

Our event team is there for you! We are at your side and support you with all questions concerning your visit at the ASMPT booth and afterwards.

Contact us

Best-in-class solutions

As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.

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