ASMPT SMT Solutions

SMT topics in focus

SMT topics in focus

ASMPT @ productronica 2025

Step into a new era of electronics manufacturing with us

Experience the spectacular world premiere of our new placement platform and solder paste printer – true game changers that will drive your smart production forward.

In addition, discover our cutting-edge solutions in hybrid advanced packaging, powerful OSC handling, integrated software, and end-to-end process automation, setting new standards in electronics manufacturing.

The future of electronics manufacturing starts at ASMPT booth 377, hall A3

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Click on the pins to learn more about our Experience Areas!

1. A new era in placement

1. A new era in placement

The all-new SIPLACE platform marks the start of a new chapter in SMT production. Setting benchmarks in speed, quality and flexibility, it not only integrates smoothly into existing lines and ensures full backward compatibility, but also delivers up to 30% more performance – all within a more compact footprint.

2. Solder paste printing premiere

2. Solder paste printing premiere

One of the highlights at our booth: the new DEK solder paste printer for large-format PCBs. Engineered to meet the toughest demands of high-performance computing and AI applications, it delivers outstanding precision and speed – even with today’s most complex designs.

3. SIPLACE CA2 – a European trade show premiere for a hybrid wonder

3. SIPLACE CA2 – a European trade show premiere for a hybrid wonder

Making its European trade show debut: the SIPLACE CA2. This unique hybrid platform brings together SMT placement and die handling straight from the sawn wafer – unlocking groundbreaking opportunities for advanced packaging in high-volume manufacturing.

4. OSC Package – handling complex components with ease

4. OSC Package – handling complex components with ease

The OSC Package ensures reliable, high-precision processing of oversized special components, BGAs and demanding packages – powered by cutting-edge vision and inspection technology.

5. Software & digitalization

5. Software & digitalization

The applications of the WORKS Software Suite proactively optimize all workflows along the line, while ASMPT’s Factory Solutions largely automate cross-factory workflows such as material management. Together, they deliver transparency and efficiency – paving the way to the intelligent factory.

6. ASMPT Semiconductor Solutions

6. ASMPT Semiconductor Solutions

With the powerful multi-chip die bonder MEGA and the ultra-precise die and flip-chip bonder AMICRA NANO, ASMPT showcases technologies that redefine standards in performance, miniaturization, and process reliability – confidently meeting even the toughest challenges in today’s semiconductor and optoelectronics manufacturing.

7. Critical Manufacturing

7. Critical Manufacturing

ASMPT’s software division showcases a state-of-the-art MES designed exclusively for the needs of electronics manufacturing.

8. Process Lens SPI – measure what matters

8. Process Lens SPI – measure what matters

The Process Lens high-end 5D SPI system offers an unprecedented combination of speed and precision, and thanks to the use of powerful state-of-the-art algorithms, it understands exactly what it measures and knows how to interpret the results.

9. DEK TQ – maximum quality and performance paired with high flexibility

9. DEK TQ – maximum quality and performance paired with high flexibility

The DEK TQ is superfast (core cycle time: only 5 to 6.5 seconds), highly precise (±17.0 microns @ 2 cmk), and a real space-saver. With two model versions, the platform now also features outstanding flexibility: the DEK TQ for boards measuring up to 400 by 400 millimeters, and the DEK TQ L for boards measuring up to 600 by 510 millimeters.

The new automation features take line flexibility and availability to a new level.

Electronics manufacturing is entering a new era. From automotive and high-performance computing to AI, telecom and consumer electronics, requirements are growing at record speed. Yet with every challenge comes opportunity: breakthrough technologies are setting new standards in efficiency and competitiveness – and opening the door to the next generation of smart manufacturing.

At productronica 2025, ASMPT will showcase how these opportunities become reality – with innovative hardware and software solutions that combine productivity, quality, flexibility and connectivity. These solutions will deliver a sustainable boost to innovation and efficiency in electronics manufacturing.

Get your free productronica ticket!

With our ticket code prod25_ASMPT you will receive a free four-day ticket.

Redeem ticket code here

ASMPT SMT Solutions

ASMPT SMT Solutions provides electronics manufacturers with state-of-the-art, high-performance, integrated hardware and software solutions for future-proof and intelligent SMT production, including the market-leading DEK solder paste printers and SIPLACE placement machines.

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ASMPT SEMI Solutions

ASMPT SEMI Solutions offers a diverse range of Advanced Packaging and Mainstream products and integrated solutions for the microelectronics, semiconductor, photonics, and optoelectronics industries. ASMPT’s ALSI, AMICRA, NEXX and AEI product lines are part of the SEMI segment.

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Critical Manufacturing

Critical Manufacturing is a wholly-owned subsidiary of ASMPT and offers the industry’s most modern manufacturing execution systems (MES).

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Meet us at productronica

Schedule a meeting with your ASMPT sales partner for a one-on-one conversation at the booth.

Book an appointment now

Impressions from productronica 2023

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Best-in-class solutions

As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.

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