SMT topics in focus
“We Boost Your Intelligent Factory” – under this guiding theme, we presented a true fireworks display of innovation at productronica 2025 and experienced an exceptionally successful show.
At the center of attention was the world premiere of the SIPLACE V, which drew strong interest from the very first moment and powerfully demonstrated the potential of the next generation of placement technology.
The new DEK TQ XL, together with our solutions for advanced packaging, OSC handling, integrated software and end-to-end automation, also attracted significant interest and underscored how consistently we are advancing the intelligent factory.
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The all-new SIPLACE V platform marks the start of a new chapter in SMT production. Setting benchmarks in speed, quality and flexibility, it not only integrates smoothly into existing lines and ensures full backward compatibility, but also delivers up to 30% more performance – all within a more compact footprint.
The all-new SIPLACE V platform marks the start of a new chapter in SMT production. Setting benchmarks in speed, quality and flexibility, it not only integrates smoothly into existing lines and ensures full backward compatibility, but also delivers up to 30% more performance – all within a more compact footprint.Thanks to the increased number of feeder slots and the capability to handle very large, heavy, and complex-shaped components, the SIPLACE V L offers maximum flexibility.
One of the highlights at our booth: the new DEK TQ XL solder paste printer for large-format PCBs. Engineered to meet the toughest demands of high-performance computing and AI applications, it delivers outstanding precision and speed – even with today’s most complex designs.
Making its European trade show debut: the SIPLACE CA2. This unique hybrid platform brings together SMT placement and die handling straight from the sawn wafer – unlocking groundbreaking opportunities for advanced packaging in high-volume manufacturing.
The OSC Package ensures reliable, high-precision processing of oversized special components, BGAs and demanding packages – powered by cutting-edge vision and inspection technology.
The applications of the WORKS Software Suite proactively optimize all workflows along the line, while ASMPT’s Factory Solutions largely automate cross-factory workflows such as material management. Together, they deliver transparency and efficiency – paving the way to the intelligent factory.
With the powerful multi-chip die bonder MEGA and the ultra-precise die and flip-chip bonder AMICRA NANO, ASMPT showcases technologies that redefine standards in performance, miniaturization, and process reliability – confidently meeting even the toughest challenges in today’s semiconductor and optoelectronics manufacturing.
ASMPT’s software division showcases a state-of-the-art MES designed exclusively for the needs of electronics manufacturing.
The Process Lens high-end 5D SPI system offers an unprecedented combination of speed and precision, and thanks to the use of powerful state-of-the-art algorithms, it understands exactly what it measures and knows how to interpret the results.
The DEK TQ is superfast (core cycle time: only 5 to 6.5 seconds), highly precise (±17.0 microns @ 2 cmk), and a real space-saver. With two model versions, the platform now also features outstanding flexibility: the DEK TQ for boards measuring up to 400 by 400 millimeters, and the DEK TQ L for boards measuring up to 600 by 510 millimeters.
The new automation features take line flexibility and availability to a new level.
Electronics manufacturing is entering a new era. From automotive and high-performance computing to AI, telecom and consumer electronics, requirements are growing at record speed. Yet with every challenge comes opportunity: breakthrough technologies are setting new standards in efficiency and competitiveness – and opening the door to the next generation of smart manufacturing.
At productronica 2025, ASMPT demonstrated impressively how these opportunities can become a reality – with innovative hardware and software solutions that combine productivity, quality, flexibility and connectivity. These solutions will deliver a sustainable boost to innovation and efficiency in electronics manufacturing.
The completely newly designed SIPLACE V platform delivers a performance boost of up to 30 percent under real production conditions, combining maximum speed with outstanding flexibility. With its compact footprint, full compatibility with existing ASMPT solutions, and long-term investment security, it sets new standards in electronics manufacturing.
30 % more real performance Under real production conditions, performance increases compared to conventional platforms were measured in key industries: 30% in automotive, IT, and network infrastructure, and 15% in consumer electronics and smartphones.
100 % Process Excellence The SIPLACE V platform has been completely newly developed, combining a robust machine frame, precise linear drives, and high-resolution measurement systems for precise placement up to 25 µm @ 3σ. Perfectly adjusted placement force and precise alignment ensure error-free placement.
Unlimited Flexibility Three new placement heads that can be exchanged during operation make the SIPLACE V suitable for high-speed, mixed placement, and special components. The platform covers the entire spectrum of components – from ultra-small 016008M chips to large-format components.
Ready for the future The platform's modular system architecture is open to future developments. Gigabit Ethernet connectivity and an integrative data concept pave the way for further automation, machine networking, and AI analysis steps.
Go to the SIPLACE V product page
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The new DEK TQ XL solder paste printer is developed for oversized circuit boards in the high-end segment. It expands the proven DEK TQ platform and sets new standards in board size, precision and productivity. It also fits seamlessly into ASMPT’s Intelligent Factory concept, combining maximum printing performance with end-to-end line integration.
The DEK TQ XL prints circuit boards measuring up to 850 × 610 × 8 millimeters and weighing up to 12 kilograms. It also handles warpages of up to 4 mm and prints the entire surface.
With its performance and wet-printing accuracy of ± 20 µm @ 2.0 cpk, it sets new records in its class, yet is extremely compact, measuring only 1.77 × 1.8 × 1.6 meters (L×W×H).
The ASMPT NuMotion control system with fiberoptics and a highly efficient understencil cleaning system ensures maximum printing speed. Separate linear drives shorten the cleaning cycles by up to 50 percent compared to conventional solutions, resulting in an unrivaled cycle time of only 12 seconds.
The optional Dual Access Cover makes it possible to replace paste cartridges without having to stop the machine.
As automotive applications, 5G and 6G, smart devices and many others require ever more compact and powerful components, advanced packaging becomes one of the key technologies. The hybrid SIPLACE CA2 combines high-speed chip assembly directly from the wafer with SMT placement in a single machine.
With the hybrid placement solution SIPLACE CA2, ASMPT addresses the growing demand for integrated manufacturing solutions. This enables the production of SiPs (System-in-Package modules) to be integrated directly into the SMT line. The SIPLACE CA2 processes both SMDs from tapes and dies taken directly from the wafer in a single step at speeds of up to 54,000 dies or 76,000 SMT components per hour with a precision of up to 10 microns @ 3 σ.
The result: maximum flexibility, efficiency, productivity and quality paired with enormous savings in time, costs, floor space, and tape waste.
With potential annual savings of 800 kilometers of carrier tape in 24/7 SiP production and a range of high-performance features, the SIPLACE CA2 is a future-proof and economically attractive investment.
Go to the SIPLACE CA2 product page
ASMPT SMT Solutions provides electronics manufacturers with state-of-the-art, high-performance, integrated hardware and software solutions for future-proof and intelligent SMT production, including the market-leading DEK solder paste printers and SIPLACE placement machines.
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ASMPT SEMI Solutions offers a diverse range of Advanced Packaging and Mainstream products and integrated solutions for the microelectronics, semiconductor, photonics, and optoelectronics industries. ASMPT’s ALSI, AMICRA, NEXX and AEI product lines are part of the SEMI segment.
Critical Manufacturing is a wholly-owned subsidiary of ASMPT and offers the industry’s most modern manufacturing execution systems (MES).
As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.