Director Product Management
SMT topics in focus
Smart devices, 5G communication standards, autonomous driving: Only consistent miniaturization and ever-increasing complexity in electronics make all of this possible. The key technology behind this is System in Packages (SiP): ICs and SMT components are combined into a compact, highly innovative system.
As a hybrid combination of a SMT placement machine and a die bonder, the new SIPLACE CA2 can process both SMDs supplied from changeover tables and feeders as well as dies taken directly from the sawn wafer in a single work step. By integrating the complex die bonding process into the SMT line it eliminates the need for special machines in production. With reduced personnel deployment, high connectivity, and integrative data utilization, the SIPLACE CA2 is therefore the perfect match for the Intelligent Factory.
Discover the efficiency of direct wafer placement: By eliminating the taping process, operators have fewer replenishment and splicing tasks as well as less effort for material feeding. In just one year, 800 km of tape can be saved with 24/7 SiP production.
Processes SMT components and dies directly from the wafer with die-attach and flip-chip processes in the same work step.
No taping cost, no associated quality cost of the die-taping process, and no efforts for tape-waste disposal.
Wafer system for up to 50 different wafers with a wafer swap time of less than 10 seconds (“full multi-die capability”). A wafer chuck, flux (linear) dipping unit (LDU) and 10 x 8 mm tape-and-reel feeder tracks can be used parallel to pick up from wafer.
Keep track of data for each die from its source on the wafer to its placement position on the circuit board ("full single-die-level-traceability").
This allows you to operate sustainably and efficiently: die processing directly from the diced wafer not only saves you the entire die-taping process but also significantly reduces tape waste. Within a year, you can save 800 km of tape in 24/7-SiP production.
Thanks to die buffering and process parallelization, the SIPLACE CA2 can place up to 54,000 components per hour directly from wafer with an accuracy of up to 10 μm @ 3 σ.
Multiple high-end vision systems reliably recognize even the smallest components and elements for comprehensive process control.
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The combination of the SIPLACE CA2 with the SIPLACE TX micron high-speed placement machine from ASMPT is particularly interesting in SiP production: both machines can be installed in one production line and complement each other - for maximum flexibility and maximum yield.
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As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.