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Fuyan Yang

Director Product Management
Placement Solutions

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SMT topics in focus

SIPLACE OSC Package

Master all challenges

 

With SIPLACE equipment, the perfect interaction between placement head and vision system makes it easy to master the challenges posed by OSCs.

  • Placement forces of up to 100 N
  • Snap-in recognition
  • Real-time 3D measurement of contact pins
  • Automatic placement speed optimization
  • Automatic illumination setting for OSC components
  • Crack detection -Component cracks can be identified via the PCB camera inspection prior to pick up as shown in the pictures (i.e. at bare dies)
  • Component weight up to 300 g 
  • NEW: Measure moment of inertia

 

Related topics

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LED Centering

Align LEDs at the precise center

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SIPLACE Placement Head CPP

SIPLACE Placement Head CPP

The first head that changes its mode on demand

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SIPLACE Placement Head TWIN

SIPLACE Placement Head TWIN

Intelligent and forceful

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As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.

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