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Hybrid Bonding for Co-Packaged Optics
Even the fastest computer is only as powerful as its external connections. The data highways of the AI-driven future require electro-optical components with ultra-fine structures. To support their production with the highly innovative hybrid bonding technology, ASMPT has developed the AMICRA NANO die and flip-chip bonder. Experience the latest generation of this cutting-edge machine at our booth.
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Sintering Innovation for Power Electronics
Power modules, like those used in electric vehicles, are required to endure high currents and thermal stress. Silver sintering is the optimal bonding technology for this purpose. With SilverSAM™, we are preparing this technology for mass production. Find out more about the potential of our universal platform from our experts on the booth, and take a look at a range of sample products.
We look forward to seeing you at the electronica 2024 show. Getting your free ticket is easy:
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Follow this link to the official electronica 2024 website, enter the ASMPT ticket number and follow the instructions to order your personal ticket.
Your personal ticket, which is good for all four show days, will arrive via e-mail. Simply print it out and bring it with you to the show.
You can also get a free ticket at the show. Just request our personal ASMPT ticket number, bring it to the show, and register at the check-in desk.
Our event team is there for you! We are at your side and will gladly support you. We are happy to help you with any questions you may have about your visit to the ASMPT booth.
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As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.