Strong partnership for innovative Advanced Packaging technologies At NEPCON Japan, Shinwa showcased its capabilities as a full-spectrum equipment provider for the semiconductor and electronics industries. The company highlighted its portfolio of precision dispensing systems, solder paste solutions, solder joint inspection equipment, and advanced packaging technologies, alongside world-leading placement solutions from ASMPT SMT Solutions. A key highlight was ASMPT’s award-winning hybrid placement solution, SIPLACE CA2, recently honored with a Global Technology Award. Designed to meet the growing demand for integrated manufacturing concepts, SIPLACE CA2 unites semiconductor and SMT processes within a single platform. System-in-Package (SiP) production is seamlessly integrated directly into the SMT line, enabling the placement of both tape-and-reel SMD components and dies from sawn wafers in one process step. With performance of up to 54,000 dies or 76,000 SMT components per hour and placement accuracy of up to 7 µm @ 3 σ, the solution sets new benchmarks for efficiency and precision. Visitors also explored the SIPLACE TX micron, engineered for advanced packaging and high-density applications. With ±10 µm placement accuracy and output of up to 93,000 components per hour, it is ideally suited for highly complex, precision-critical production environments. Complementing these platforms, ASMPT presented the DEK TQ range of solder paste printers, including innovative automation features such as the DEK TQ GO automatic stencil exchange system, designed to further enhance productivity and process reliability. With a strong sales and support network in Japan, Shinwa proved to be an ideal partner for ASMPT solutions, particularly for the automotive sector. Combining Shinwa’s factory automation expertise with ASMPT’s focus on digital transformation and intelligent factories, the companies offer future-ready manufacturing solutions that meet the highest standards of precision and performance.