SIPLACE V

The new era of placement technology

The newly designed SIPLACE V platform combines leading performance, maximum flexibility and highest precision with full compatibility to existing SMT lines.

At the same time, it is consistently designed to meet the requirements of the future – for further automation, efficient big data processing and long-term investment security.

SIPLACE V:
30 % more real performance

The SIPLACE V is a real game changer in terms of performance.

In key industries – from high-mix, low-volume to high-speed production – it achieves a performance increase of up to 30 percent under real production conditions.

This gives electronics manufacturers a clear competitive advantage, especially in the growth markets of the future.

100 % process excellence

No compromises when it comes to quality: The SIPLACE V stands for maximum precision and consistent top performance in every detail.

Maximum precision: New linear drives and measuring systems with higher resolution for precise placement down to 25 µm @ 3σ.
Intelligent sensor technology: Closed-loop control adjusts placement force in real time for consistently high quality with every component.
Perfect alignment: Individually rotatable nozzle segments ensure exact angular positions and error-free placement.
Automated quality assurance: High-resolution cameras check every component; variable pick-up positions and PCB warping are automatically compensated.
Seamless traceability: Complete traceability of all components – ideal for automotive applications.
Process reliability for complex components: Smart Pin Support and improved OSC processing guarantee stable results even with special components.

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Unlimited Flexibility

Whether it's high speed, mixed placement or special components: The SIPLACE V offers the right solution for all production requirements.

Comprehensive range of components: From ultra-small 016008M components to large-format odd-shaped components (OSCs), including BGAs.
Three placement heads for every application: Easy replacement during operation thanks to a new universal head interface.
Extended feeder capacity: Up to 45 × 8 mm feeders can be used at each location – regardless of options. Supports all SIPLACE X feeders, linear dipping units, power connectors, SIPLACE glue feeders and SIPLACE measuring feeders.
Flexible transport system: Choice of single or double transport for different PCB sizes and production requirements.
New Tray Unit V: Slim and space-saving.
Flexible machine configuration: Choice of single or double gantry version, single or dual conveyor, optional 3D Koplan module and additional cameras.

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Ready for the future

Ready for whatever comes next: The SIPLACE V combines today's performance with true future-proofing.

Open system architecture: Developed from the ground up to be modular and prepared for future pick-and-place head generations and future process requirements.
High-speed data communication: Gigabit Ethernet for maximum bandwidth, minimal latency, seamless M2M communication and efficient big data management and analysis functions.
AI and data analysis capable: Integrative data concept creates the basis for AI-supported process optimisation and predictive quality control.
Automation ready: Already designed for auto-loading feeder, automated feeder change and further automation steps in production.
Extended platform variants: The SIPLACE V L is a version for large-format PCBs and high components up to 55 mm.
Seamless software integration: Compatibility with WORKS Software Suite and Factory Solutions from ASMPT

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SIPLACE V in field testing at Zollner Elektronik AG

After some 25,000 assembled flat modules and 7.3 million components placed, we can confirm that the field test of the SIPLACE V platform in our high-mix, low-volume production was a complete success. The new placement machines from ASMPT are once again setting new standards in terms of performance, flexibility, quality and effective placement output.

Martin Zistler, Vice President, Global Engineering, Zollner Elektronik AG

Optimized placement technology

ASMPT has also consistently refined SIPLACE technology in the area of placement heads.

Placement Head CP20

The high-speed collect-and-place placement head with up to 52,500 BE/h at 25 µm @ 3σ precision.

Placement Head CPP

The allrounder for mixed assemblies switches between collect-and-place, pick-and-place or mixed mode via software control.

Placement Head TWIN VHF

The specialist for large and heavy components with up to 100 N placement force for components up to 200 × 150 × 28 mm.

SIPLACE V Boosts Your Intelligent Factory

Setting new standards in placement performance, Flexibility and quality: The SIPLACE V platform is more than just the next generation of placement machines. With significant performance improvements under real production conditions, it gives electronics manufacturing the decisive boost it needs for powerful, future-proof and sustainable intelligent manufacturing.

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SIPLACE V at a glance

Up to 30 per cent performance increases in key industries
Significantly higher performance, even under real production conditions
Maximum flexibility, even in high-speed applications
Proven quality assurance features
Superior performance reserves for future expansions
Full compatibility with existing ASMPT hardware and software
Maximum future-proofing and investment security

	SIPLACE V
Placement speed	105,000 cph
Standard accuracy	±25 µm @ 3 σ
PCB dimension (L × W)	up to 850 mm × 610 mm Single-lane mode up to 400 mm × 280 mm Dual-lane mode up to 700 mm × 530 mm Dual as single
Feeder slots	up to 90 x 8 mm tape feeders
Machine dimensions (L × W × H)	1.1 m × 2.4 m × 1.6 m

M2M communication interfaces: IPC-HERMES-9852, WORKS Operations Information Broker, IPC-CFX
WORKS Software Suite: In combination with WORKS Software Suite applications, you can automate process optimization, material supply and operator control operations as well as program changeovers during product changes.
SMT Analytics: In-depth analysis software for improving assembly throughput rates and lowering manufacturing costs by recognizing even hard-to-pinpoint deficits.

Placement Head CP20 – for maximum accuracy and speed
- For components ranging from 016008M to 8.2 mm × 8.2 mm × 4 mm (L × W × H)
- Speed: Up to 52,000 cph
- Accuracy: Up to ±25 μm @ 3 σ
- Placement force: 0.5 N to 4.5 N
- Perfect for the fast assembly of standard components at the head of the SMT line
Placement Head CPP – for maximum flexibility
- For components ranging from 01005 to 50.0 mm × 40.0 mm × 15.5 mm (L × W × H)
- Speed: Up to 28,000 cph
- Accuracy: Up to ±25 μm @ 3 σ
- Switches as needed between pick-and-place, collect-and-place and mixed modes
- For perfectly balanced line operation during quick product changeovers with no time-consuming configuration and head changes
Placement Head TWIN – for maximum force
- Places components ranging from 0402 to 200 mm × 150 mm × 25/50 mm (TWIN VHF version) (L × W × H)
- Speed: Up to 6,000 cph
- Accuracy: Up to ±20 μm @ 3 σ
- Placement force: 1.0 N to 100 N (TWIN VHF version)
- Component weight up to 300 g (TWIN VHF version)
- Snap-in detection and 3D measurement in real time
- Perfectly suited for automated end-of-line placement of large and heavy components such as connectors, specialty components, and odd shapes
SIPLACE Measuring Feeder: Precise measurement and verification of components to avoid incorrect placements and improve process reliability
SIPLACE Glue Feeder: Automated application of adhesives for reliable component fixation and improved process reliability
Linear Dipping Unit (LDU): For efficient dipping and placement, also in applications with smaller quantities and multiple dies
SIPLACE Power Connector X: Online power supply with SIPLACE Power Connector X enables feeder preparation or troubleshooting, without stopping the machine
SIPLACE Smart Pin Support: Automated placement of support pins
Tray Unit: Flexible supply system for JEDEC trays
LED Centering: Precise placement of LEDs
OSC Package: Software and hardware solutions for placing large and heavy odd-shaped components
Stationary component cameras: Type 53GigE and type 56GigE
On-board PCB Inspection: Solder paste, pre-placement and post-placement inspection for zero-DPM production
3D Coplanarity Sensor: Detects faulty components for optimal process control
Smart Nozzle Reader: Detects smart nozzles with unique IDs for optimal process control

Up to 30 per cent performance increases in key industries
Significantly higher performance, even under real production conditions
Maximum flexibility, even in high-speed applications
Proven quality assurance features
Superior performance reserves for future expansions
Full compatibility with existing ASMPT hardware and software
Maximum future-proofing and investment security

	SIPLACE V
Placement speed	105,000 cph
Standard accuracy	±25 µm @ 3 σ
PCB dimension (L × W)	up to 850 mm × 610 mm Single-lane mode up to 400 mm × 280 mm Dual-lane mode up to 700 mm × 530 mm Dual as single
Feeder slots	up to 90 x 8 mm tape feeders
Machine dimensions (L × W × H)	1.1 m × 2.4 m × 1.6 m

M2M communication interfaces: IPC-HERMES-9852, WORKS Operations Information Broker, IPC-CFX
WORKS Software Suite: In combination with WORKS Software Suite applications, you can automate process optimization, material supply and operator control operations as well as program changeovers during product changes.
SMT Analytics: In-depth analysis software for improving assembly throughput rates and lowering manufacturing costs by recognizing even hard-to-pinpoint deficits.

Placement Head CP20 – for maximum accuracy and speed
- For components ranging from 016008M to 8.2 mm × 8.2 mm × 4 mm (L × W × H)
- Speed: Up to 52,000 cph
- Accuracy: Up to ±25 μm @ 3 σ
- Placement force: 0.5 N to 4.5 N
- Perfect for the fast assembly of standard components at the head of the SMT line
Placement Head CPP – for maximum flexibility
- For components ranging from 01005 to 50.0 mm × 40.0 mm × 15.5 mm (L × W × H)
- Speed: Up to 28,000 cph
- Accuracy: Up to ±25 μm @ 3 σ
- Switches as needed between pick-and-place, collect-and-place and mixed modes
- For perfectly balanced line operation during quick product changeovers with no time-consuming configuration and head changes
Placement Head TWIN – for maximum force
- Places components ranging from 0402 to 200 mm × 150 mm × 25/50 mm (TWIN VHF version) (L × W × H)
- Speed: Up to 6,000 cph
- Accuracy: Up to ±20 μm @ 3 σ
- Placement force: 1.0 N to 100 N (TWIN VHF version)
- Component weight up to 300 g (TWIN VHF version)
- Snap-in detection and 3D measurement in real time
- Perfectly suited for automated end-of-line placement of large and heavy components such as connectors, specialty components, and odd shapes
SIPLACE Measuring Feeder: Precise measurement and verification of components to avoid incorrect placements and improve process reliability
SIPLACE Glue Feeder: Automated application of adhesives for reliable component fixation and improved process reliability
Linear Dipping Unit (LDU): For efficient dipping and placement, also in applications with smaller quantities and multiple dies
SIPLACE Power Connector X: Online power supply with SIPLACE Power Connector X enables feeder preparation or troubleshooting, without stopping the machine
SIPLACE Smart Pin Support: Automated placement of support pins
Tray Unit: Flexible supply system for JEDEC trays
LED Centering: Precise placement of LEDs
OSC Package: Software and hardware solutions for placing large and heavy odd-shaped components
Stationary component cameras: Type 53GigE and type 56GigE
On-board PCB Inspection: Solder paste, pre-placement and post-placement inspection for zero-DPM production
3D Coplanarity Sensor: Detects faulty components for optimal process control
Smart Nozzle Reader: Detects smart nozzles with unique IDs for optimal process control