DEK Galaxy

Advanced packaging and
high-precision SMT assembly

The DEK Galaxy printer delivers exceptional performance, flexibility, and maximum precision (±12.5 μm @ 2cmk), all with a fast 7-second cycle time. Designed to meet diverse production requirements, it enables seamless transitions between wafer bumping with solder paste printing, SMT pre-assembly for next-generation assemblies, and DirEKt Ball Attach on wafers or substrates with ball diameters as small as 0.2 mm.

With a range of configuration options, the DEK Galaxy is built for efficiency and precision. Singulated tooling systems allow for individual alignment and multi-substrate printing within a single cycle. JEDEC wafer chucks and carriers ensure smooth wafer and substrate processing, while Grid-Lok® and customized tooling provide advanced substrate support, even for high-density assemblies.

Top performance and flexibility at wafer, substrate and PCB level

As a stand-alone offering or as part of a turnkey process configured by ASMPT specialists: DEK Galaxy is the ultimate performer.

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DEK Galaxy at a glance

Extensive flexibility: Wafer bumping by solder paste printing, SMT pre-assembly for next-generation assemblies or DirEKt Ball Attach on wafers or substrates with ball diameters down to 0.2 mm.
Singulated substrate tooling: Allows for individual alignment and processing of multiple substrates within one print cycle (VPT / TRS / MASS)
3D Stencil printing: Capable of 3D stencil printing with AgS paste for power electronics packaging
Maximum precision: Wet-print accuracy of up to ±17.5 µm @ 2 cpk
High throughput: Core cycle time of 7 seconds
High print quality: Leading to greater first pass yield
Fast New Product Introduction (NPI): Fast setup and first print, easier operation and error prevention and correction

Maximum print area	600 mm (X) × 508.5 mm (Y)
Substrate size (min.)	50 mm (X) x 40.5 mm (Y)
Substrate size (max.)	620 mm (X) x 508.5 mm (Y)
Machine alignment capability	> 2.0 cmk @ ±12.5 μm, (±6 sigma)
System alignment capability	> 2.0 cmk @ ±12.5 μm, (±6 sigma)
Wet print capability	> 2.0 cpk @ ±17.5 μm, (±6 Sigma)
Core Cycle Time (CCT)	7 seconds
Machine dimensions	2060 x 1500 x 1570 mm (L x W x H)

M2M communication interfaces: IPC-HERMES-9852, IPC-2591 CFX
Closed-loop connection to SPI systems: Advanced solder paste control with ProDEK and WORKS Optimization
Seamless Integration & Smart Connectivity: Customer MES via ASMPT WORKS software suite
Semiconductor options: SEMI S2/S8, SECS GEM

Typhoon stencil cleaning system: Flexible insert types and chamber lengths for optimal cleaning performance for every process and stencil
Material Management: The combination of DEK Paste Roll Height Monitor and DEK Automatic Paste Dispenser controls the paste quantity automatically
Multiple Alignment of Singulated Substrates (MASS): Multiple substrates are optically aligned at the same time
Virtual Panel Tooling (VPT): Allows the printer to process multiple individual substrates in a single print cycle
Topside Reference System (TRS): Ideal for processing challenging parts such as LGAs, BGAs, 01005 passives and 0.25 mm to 0.3 mm BGAs
Strip substrate: Dediated strip substrate tooling solutions available for SIP in strip format
HawkEye verification: Quickly verifies the printing results within the printer itself

Extensive flexibility: Wafer bumping by solder paste printing, SMT pre-assembly for next-generation assemblies or DirEKt Ball Attach on wafers or substrates with ball diameters down to 0.2 mm.
Singulated substrate tooling: Allows for individual alignment and processing of multiple substrates within one print cycle (VPT / TRS / MASS)
3D Stencil printing: Capable of 3D stencil printing with AgS paste for power electronics packaging
Maximum precision: Wet-print accuracy of up to ±17.5 µm @ 2 cpk
High throughput: Core cycle time of 7 seconds
High print quality: Leading to greater first pass yield
Fast New Product Introduction (NPI): Fast setup and first print, easier operation and error prevention and correction

Maximum print area	600 mm (X) × 508.5 mm (Y)
Substrate size (min.)	50 mm (X) x 40.5 mm (Y)
Substrate size (max.)	620 mm (X) x 508.5 mm (Y)
Machine alignment capability	> 2.0 cmk @ ±12.5 μm, (±6 sigma)
System alignment capability	> 2.0 cmk @ ±12.5 μm, (±6 sigma)
Wet print capability	> 2.0 cpk @ ±17.5 μm, (±6 Sigma)
Core Cycle Time (CCT)	7 seconds
Machine dimensions	2060 x 1500 x 1570 mm (L x W x H)

M2M communication interfaces: IPC-HERMES-9852, IPC-2591 CFX
Closed-loop connection to SPI systems: Advanced solder paste control with ProDEK and WORKS Optimization
Seamless Integration & Smart Connectivity: Customer MES via ASMPT WORKS software suite
Semiconductor options: SEMI S2/S8, SECS GEM

Typhoon stencil cleaning system: Flexible insert types and chamber lengths for optimal cleaning performance for every process and stencil
Material Management: The combination of DEK Paste Roll Height Monitor and DEK Automatic Paste Dispenser controls the paste quantity automatically
Multiple Alignment of Singulated Substrates (MASS): Multiple substrates are optically aligned at the same time
Virtual Panel Tooling (VPT): Allows the printer to process multiple individual substrates in a single print cycle
Topside Reference System (TRS): Ideal for processing challenging parts such as LGAs, BGAs, 01005 passives and 0.25 mm to 0.3 mm BGAs
Strip substrate: Dediated strip substrate tooling solutions available for SIP in strip format
HawkEye verification: Quickly verifies the printing results within the printer itself