Why future-proof placement platforms need to be rethought

For decades, it was relatively easy to assess the performance of an automated placement machine. The key factors were speed, accuracy, and price. Whoever could place more components per hour was considered a technological leader.

Today, this perspective falls short. AI servers, automotive electronics, and data transmission infrastructure systems combine highly miniaturized standard components with large connectors, heavy ball grid arrays (BGAs), and increasingly complex printed circuit boards. At the same time, material costs and quality requirements are rising, while product lifecycles are becoming shorter and changeovers more frequent.

Future-proof placement platforms must combine high speed, flexibility, and consistent process quality with cost-effective production. However, the decisive factor here is not maximum benchmark performance – which is usually determined under ideal production conditions – but rather performance in real-world production operations.

Real-world performance instead of benchmarks under manufacturer conditions

The performance actually achievable in the day-today operations of an electronics manufacturing facility is influenced by frequent product changes, different components, complex printed circuit boards, and high quality requirements. The machine architecture of the SIPLACE V platform was specifically redesigned to meet these requirements.

A stiffer machine design enables higher dynamics of the main axes with accelerations of up to 6 G. In addition, shorter travel distances reduce unproductive movements. Together, these two factors increase effective placement throughput. Depending on the application, the SIPLACE V can achieve performance increases of up to 30 percent under real production conditions – including in IT and network infrastructure, automotive and industrial electronics, consumer electronics, and smartphones.

A field test at Zollner Elektronik AG demonstrated how these design changes impact real-world performance in practice. There, the SIPLACE V replaced an existing placement machine on a highmix, low-volume line. Even within a previously optimized manufacturing process, it further reduced the cycle time for a printed circuit board from 54 to 38 seconds. After producing approximately 25,000 printed circuit boards and placing 7.3 million components, Zollner confirmed both the increased performance and the high process stability of the new platform.

The new platform also delivers improved area productivity. With a footprint of just 2.4 × 1.1 m and the significantly slimmer SIPLACE V tray unit, it combines high placement throughput with a compact footprint.

Performance requires the right head

The specialized placement heads of the SIPLACE V play a major role in the higher real-world performance. Instead of a universal design, ASMPT relies on three variants tailored for different component ranges and placement tasks.

For maximum performance with standard components, the CP20 collect-and-place placement head is used. With a placement rate of up to 52,500 components per hour and an accuracy of ±25 µm @ 3σ, it is particularly well-suited for high-speed applications with high volumes and densely populated PCBs. With a component range from 016008M to 8.2 × 8.2 mm, it covers the vast majority of typical SMT placement tasks.

The CPP placement head truly shines when a wide variety of components are being placed on a printed circuit board. It switches between Collect-and-Place, Pick-and-Place, and Mixed modes via software control and covers a component range from 01005 to 50 × 40 × 15.5 mm. It thus combines a placement rate of up to 28,000 components per hour with an accuracy of ±25 µm @ 3σ and high flexibility. Even complex mixed placements can be produced cost-effectively without retooling.

For large-format and heavy components, such as processor BGAs, connectors, or other odd-shaped components (OSCs), the TWIN VHF (Very High Force) placement head is available. With component dimensions of up to 200 × 150 × 28 mm and placement forces of up to 100 N, the TWIN VHF is also suitable for demanding placement tasks in AI servers, power electronics, and communication systems.

Quality shouldn’t come at the expense of time

Higher-density PCBs, smaller components, and larger OSCs place greater demands on process stability. However, high speed must not come at the expense of quality.

Quality checks accompany the entire placement process on the SIPLACE V – the first one begins right at the pipette. The highly integrated placement head automatically checks the condition of the pipettes using its component camera, approves clean pipettes for production, sends contaminated ones for cleaning, and rejects damaged ones.

Its integrated component sensor monitors every single step – from pickup to the actual placement process. It continuously checks whether the component is present and measures its height down to 50 µm. After pickup, the placement head detects the orientation at the pipette and, using its independently driven segments, aligns each component individually to the specified placement angle.

The integrated component camera captures each component using individually adjusted lighting and image processing parameters. During this process, the position of pin 1 is also verified. The images are compared in real time with the stored reference data. The system automatically corrects X, Y, and angular offsets within a closed-loop control system. Even components that are upside down are reliably detected. This allows components ranging from 016008M to 8.2 × 8.2 mm to be placed reliably in any required angular position within a single head cycle.

Even large and heavy components are consistently included in the process control. In combination with special pipettes and functions such as Smart Pin Support, spacer inspection, and 3D coplanarity inspection, the TWIN VHF placement head places even the most demanding BGAs with high process reliability.

The integrated PCB inspection (On-Board PCB Inspection) provides additional reliability. It detects contaminants and foreign objects in critical areas, as well as missing components and spacers. In addition, the system continuously measures the PCB and automatically compensates for warping during the placement process. Software-controlled force profiles ensure that each component is placed with the optimal force for that component.

Ready for tomorrow, starting today

Increasing digitalization and ever-more-powerful sensor and camera systems are raising the bar for communication within modern SMT machines. Ever-larger volumes of data must be captured, processed, and exchanged between individual systems in real time – as the foundation for process optimization, traceability, and automation.

The SIPLACE V therefore relies on an advanced communication architecture featuring Gigabit Ethernet and free-space optics technology for internal data transmission. High bandwidths and low latencies enable the rapid exchange of large amounts of data. Via standardized interfaces such as IPC-HERMES-9852 and IPC-CFX, the platform is also networked with the entire SMT line and higher-level software systems.

The expandable architecture extends beyond data communication. New generations of placement heads, autonomous material supply, and AI-supported analysis functions can also be integrated in stages.

More than just a placement platform

The SIPLACE V demonstrates how modern placement platforms are evolving. Mechanics, sensors, image processing, data management, and software work together as an integrated system. Real-world performance in daily operations stems not only from the performance of individual components but also from their coordinated interaction.

For electronics manufacturers, this also shifts the focus when it comes to investments. There is growing demand for platforms that can be adapted over many years to new products, manufacturing technologies, and levels of automation.

The field test at Zollner demonstrated just how important compatibility is in this context. Existing feeders and software could continue to be used without any restrictions. The new header interface and Gigabit Ethernet-based internal communication ensured short ramp-up times and rapid integration into the existing production line.

The next stage of evolution

AI servers, power electronics, photonics, and new packaging technologies will continue to reshape the requirements for SMT lines. At the same time, data, software, artificial intelligence, and automation are shaping the next stage of development in electronics manufacturing.

The SIPLACE V was deliberately developed as a platform that will also support future requirements in electronics manufacturing. Its open architecture, full integration into the ASMPT software ecosystem, and standardized interfaces make it easy to integrate future technologies.

This marks a fundamental shift: placement technology is increasingly viewed as an integrated, interconnected system. The long-term performance of a placement machine is determined not only by speed and accuracy, but also by its ability to evolve in line with the demands of smart manufacturing.