SMT topics in focus
08.10.2026
From October 6 to 8, 2026, EFX in Stuttgart brought together electronics manufacturers, technology providers, and industry experts to exchange ideas on the latest developments in electronics manufacturing. Automation, digitalization, and intelligent manufacturing concepts were among the key topics discussed as companies continue to seek new ways to increase productivity, flexibility, and quality.
Throughout the three-day event, visitors had numerous opportunities to engage in technical discussions, experience live demonstrations, and exchange insights on current challenges and future requirements in electronics manufacturing. The growing complexity of electronic assemblies, the intelligent use of production data, and the increasing demands driven by AI and high-performance computing applications were recurring themes throughout the exhibition.
Developed from the ground up, the placement platform was specifically designed to meet the requirements of modern electronics manufacturing and delivers up to 30% more real-world performance under real production conditions. It combines high placement performance with maximum flexibility during product changeovers and a future-ready platform architecture for data-driven production environments.
As an extension of the SIPLACE V platform, ASMPT presented the SIPLACE V L for large-format applications. Based on the unified SIPLACE V platform concept, the variant features 120 feeder slots, supports the SIPLACE V Tray Unit, and can process components up to 55 mm in height. The SIPLACE V L therefore expands the platform’s application range with additional capabilities for large-format and demanding applications.
The exhibition presence was complemented by the DEK TQ L stencil printer. It processes PCB formats of up to 600 × 510 mm within a compact footprint of just 1.3 × 1.5 meters and achieves a wet print accuracy of ±17 µm @ 2 cpk. Its automated setup changeover also reduces manual setup time from around four minutes to approximately 30 seconds. This makes the printer particularly well suited for demanding applications involving large and complex PCB layouts, ultra-fine structures, and stringent quality requirements.
The SIPLACE V platform presented live at EFX and the DEK TQ L demonstrated how advanced printing and placement technologies can be combined into powerful and scalable manufacturing solutions. At the same time, the SIPLACE V L as an extension of the platform provided an outlook on how the SIPLACE V platform concept can be expanded in the future to address additional large-format applications.
In addition to the machines, the intelligent use of production data was another key focus. Through the WORKS Software Suite, ASMPT demonstrated how data from across the SMT line can be leveraged to increase transparency, identify deviations at an early stage, and optimize processes in a targeted manner.
Throughout the exhibition, we welcomed numerous visitors to our booth and engaged in valuable discussions with electronics manufacturers, EMS providers, and technology partners. The new SIPLACE V platform attracted particularly strong interest, along with the opportunities to increase productivity and flexibility and make even more effective use of manufacturing data for continuous process improvement.
The positive response and the high quality of the discussions once again underlined the importance of EFX as a platform for knowledge sharing, collaboration, and innovation. ASMPT would like to thank the organizers, customers, partners, and all visitors for the many valuable discussions and the open exchange in Stuttgart.
As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.