Did you know …

The more contacts a connector has, the more challenging its placement becomes. High-density connectors used in AI servers, automotive applications, and telecommunications systems are particularly demanding. Their numerous, closely spaced pins must align precisely with the corresponding holes in the PCB. Even a slightly bent pin can cause problems. And there is another question: Is the connector correctly seated after insertion?

With the SIPLACE SX, the new high-resolution stationary SST56 camera, and the SIPLACE OSC Package, even these challenging connectors can be placed and inspected automatically.

Two features of the OSC Package play a key role:

• 3D Stereo Measurement: The camera captures images of the contact pins from two slightly different perspectives. These images are used to generate a 3D representation that allows the position and height of each pin tip to be determined precisely. This works specifically for connectors, that are difficult to measure using conventional 2D vision systems.
• Snap-In Detection: During insertion, the actual Z-height of the placement position is compared with a predefined reference value. If the deviation exceeds the specified tolerance, the machine reports an error and stops the placement process.

The stationary camera SST56 provides the high-resolution images required for these measurements. Its improved illumination/pixel resolution also enables reliable detection of fine structures with low contrast.