SIPLACE TX micron

This unique combination of accuracy and record-breaking speed of up to 96,000 cph makes the SIPLACE TX micron the clear winner in the race for high-volume and high accurate placing of modules, system-in- packages and other applications focusing on miniaturization.

Highlights:

• Placement speed up to 96,000 cph
• Placement accuracy 25/20 µm @ 3 sigma down to 15 μm (equipped with vacuum tooling)
• PCB dimensions (l x w)
  Dual: 50 mm x 45 mm to 375 mm x 260 mm
  With vacuum tooling (for 15 µm): 50 mm x 55 mm to 250 mm x 100 mm
  Single: 50 mm x 45 mm to 375 mm x 460 mm
• Small footprint: 1.00 m x 2.23 m x 1.45 m
• Feeder slots up to 80 x 8 mm, Jedec Tray
• Certifications: Semi S2/S8, clean room class ISO 7
• Minimum placement force: 0.5 N for sensitive components
• Touchless placement: Highest placement quality for highly sensitive components
• Linear Dipping Unit with inspection via vision system and auto cavity

NEW for the SIPLACE TX micron: SIPLACE Tray Unit

SIPLACE Tray Unit enables non-stop feeding of components in a tray with a compact design. Maximum flexibility characterized by the following points:

• Productivity: Non-stop refilling, fast carrier changeover
• Storage capacity: 30 levels in main storage+ 12 levels in cache storage
• Large tray capacity: 355mm x 275mm (2x JEDEC per level )
• Footprint: Minimized protrusion
• Random setup: RFID on each layer
• Clarity: LED indicator for each level