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SMT topics in focus

Interaktives eMagazin
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SMT topics in focus

Interaktives eMagazin

ASMPT at Nepcon Japan 2022 in Tokyo

12.01.2022

ASM presents strong solutions for the integrated smart factory

From January 19 to 21, ASM will present its latest impressive solutions to interested trade visitors at the NEPCON Japan trade fair in Tokyo. The innovative technology leader has been the preferred partner for industrial customers in the field of electronics production for many years and will continue to inspire them in 2022. Trade fair visitors can get information about ASM’s brand-new Open Automation concept, the next-generation DEK TQ printer, the top-of-the-line Process Lens SPI system, and the SIPLACE TX micron for high-speed/high-density advanced packaging applications, to name just a few. “ASMPT is participating at the Internepcon Japan 2022. We will present to visitors the right machines and platforms that suit according to their manufacturing needs, and visitors will understand how flexible, productive and efficient ASM solutions can be, to move their factory forward and build their Integrated Smart Factory as you wish. Powerful machines and smart software are the key highlights this year. I’m looking forward to have you visit ASM “on site” and “on demand”, and I’m confident that you will find the right answers at our booth!” explains Yuzo Ishizaki, General Manager at ASM SMT Solutions Japan.

Open Automation: Modular, flexible, non-proprietary

With Open Automation, ASM presents an alternative to fully automated shop floors which tend to be inflexible and expensive. It allows electronics manufacturers to determine the degree and speed of their transition to automation in the way that works best for them. Thanks to open interfaces such as the Hermes standard or IPC-CFX, ASM’s open and modular approach combines seamless M2M and M2H communication with the integration of third-party solutions and existing systems. As a tool for economically feasible process optimization and gains in quality and efficiency, Open Automation gives electronics manufacturers the flexibility they need. ASM also provides the complete software infrastructure for establishing an integrated smart factory. It ranges from the ASM Works Basic Package for networking line components and installing an efficient shop floor management system to eight modules with enhanced functionalities for process integration and optimization to seamless vertical data exchange and synchronization between the shop floor and ERP/MES levels with the ASM Factory Automation tool. The coordination and control of AIVs to optimize factory workflows can also be managed via the new ASM Factory Automation software module.

The next generation of the DEK TQ: Compactness and top performance for step-by-step automation

With the next generation of the DEK TQ stencil printer, ASM presents the ideal combination of high-end quality and flexible automation. With its wet-print accuracy of ±17.5 microns @ 2 Cpk and core cycle time of as little as 5 seconds, the DEK TQ sets new records in terms of performance, efficiency, and precision. New features such as Smart Pin Placement and DEK All Purpose Clamping allow users to advance their degree of automation in accordance with their specific needs. The DEK TQ was also designed for operator-less runtimes of eight hours and more, and open interfaces ensure its quick and easy integration into a smart factory environment.

Process Lens SPI system: The unbeatable combination of precision and speed

A completely new HD optical system with a resolution of 20 microns in high-speed mode reduces the inspection time by up to 70 percent compared with traditional SPI systems. In the only slightly slower high-resolution mode, the system even inspects with a resolution of 10 microns. Features like these make the new Process Lens by far the fastest and most precise high-end inspection system in the industry.

SIPLACE TX micron: High speed for high density

With up to 96,000 components per hour, placement accuracies of 25, 20 or 15 microns @ 3 sigma and minimum placement distances of as little as 50 microns, the SIPLACE TX micron stands for advanced packaging and high-density applications with unsurpassed productivity.

Request to meet ASM on demand

For the first time, all of ASM’s highlights can be accessed on demand, as the extensive media library and ASM solutions shown at the booth to be available to interested online visitors: Please visit us https://www.asm-smt.com/en/lp/internepcon-japan-2022-registration/

Best-in-class solutions

As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.

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