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FACTS ON OPEN AUTOMATION
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OPEN AUTOMATION WHITE PAPER
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ASM IMPACT release summer 2022
All highlights of our latest innovations can be found here here
From February 9 - 11, technology leader ASM, the world’s largest equipment supplier to the electronics industry, will present at the SEMICON Korea trade fair in Seoul’s COEX (Hall D, Booth D312) complete process chains and compelling solutions for applications ranging from die bonding and active alignment to molding, testing and packaging. Trade fair visitors can learn about the SIPLACE TX, ASM’s solution for high-speed/high-density advance packaging applications, the next-generation DEK TQ stencil printer, the top-of-the-line Process Lens SPI system, or the brand-new Open Automation concept.
“ASMPT is participating at the Semicon Korea 2022. We will present to visitors the right machines and platforms that suit according to their manufacturing needs, and visitors will understand how flexible, productive and efficient ASM solutions can be, to move their factory forward and build their Integrated Smart Factory as you wish. Powerful machines and smart software are the key highlights this year. I’m looking forward to have you visit ASM “on site” and “on demand”, and I’m confident that you will find the right answers at our booth!" said Mr DaeSung Kim, Managing Director of South Korea, Thailand and Vietnam.
Integrated, powerful and highly miniaturized communication modules are essential components for developing a new generation of devices for 5G, the Internet of Things (IoT), or autonomous driving. These demanding electronics applications present semiconductor makers and manufacturing service providers with challenging tasks in the face of increasing cost pressures. Advanced packaging technologies offer smart solutions but require extremely complex and demand manufacturing methods with exceptional precision in all process steps. As the world’s largest equipment supplier to the semiconductor industry, ASM offers tailor-made solutions from a single source.
SIPLACE TX micron: High speed for high density
With up to 96,000 components per hour, placement accuracies of 25, 20 or 15 microns @ 3 sigma and minimum placement distances of as little as 590 microns, the SIPLACE TX micron stands for advanced packaging and high-density applications with unsurpassed productivity.
Thin-die handling in gentle mode
Since thin dies, flip-chips and the smallest 0201m components require extremely gentle handling, the entire placement process of the SIPLACE TX micron can be individually programmed for each component and placement position with features like touchless pickup and zero-force placement. And for sensitive thin dies, the vision system features advanced image processing algorithms such as cracked-die inspection and die-chipping detection. This way, components with hairline fractures and lacerated edges are detected and rejected already during the pickup process. The new SIPLACE TX micron delivers all this performance in the smallest possible space. Like its predecessor model, it has a footprint of only 2.23 by 1.0 meters (approx. 7.3 by 3.3 feet).
DEK TQ Next Generation: Compact high performance for step-by-step automation
With the next generation of the DEK TQ stencil printer, ASM presents the ideal combination of high-end quality and flexible automation. With its wet-print accuracy of ±17.5 microns @ 2 Cpk and core cycle time of as little as 5 seconds, the DEK TQ sets new records in terms of performance, efficiency, and precision. New features like Smart Pin Placement and DEK All Purpose Clamping allow users to advance the degree of automation in accordance with their needs. In addition, the DEK was designed for operator-less runtimes of eight hours and more while open interfaces ensure its quick and easy integration into the Integrated Smart Factory environment.
Process Lens SPI system: The unbeatable combination of precision and speed
Thanks to a completely new HD optical system with a resolution of 20 microns in high-speed mode, the new Process Lens reduces the inspection time by up to 70 percent compared to traditional SPI systems. In the only slightly slower high-resolution mode, the system inspects with a resolution of 10 microns. Features like these make the new Process Lens by far the fastest and most precise high-end inspection system in the industry.
Open Automation: Modular, flexible, non-proprietary
With Open Automation, ASM has developed a concept that provides an alternative to fully automated shop floors, which tend to be inflexible and expensive, because it lets electronics manufacturers determine the degree and speed of their transition to automation in the way that works best for them. Thanks to open interfaces like the Hermes standard or IPC-CFX, its open and modular approach combines seamless M2M and M2H communication with the interaction with third-party solutions and the integration into existing systems. As a tool for economically feasible process optimization and for achieving gains in quality and efficiency, Open Automation gives electronics manufacturers the flexibility they need. ASM also provides the complete software infrastructure for establishing an integrated smart factory. It ranges from ASM Works for networking all line components and installing an efficient shop floor management system to eight specific modules with advanced functionalities for process integration and optimization to seamless vertical data synchronization and exchange between the shop floor and ERP/MES levels with the ASM Factory Automation tool. For optimized workflow scheduling, the coordination and control of all AIVs can also be managed via the new ASM Factory Automation software module.
Request to meet ASM on demand
For the first time, all of ASM’s highlights can be accessed on demand, as the extensive media library and ASM solutions shown at the booth to be available to interested online visitors: Please visit us https://www.asm-smt.com/en/lp/semicon-korea-2022-registration
As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.