SMT topics in focus
From 17 – 19 Mar, together with the SEMI Solution segment of the ASMPT Group, ASMPT SMT Solutions is participating in Semicon China 2021. Jointly, we will showcase the capabilities of the SEMI solutions of chip handling and assembly to the latest DEK & SIPLACE platforms, where highest printing quality and highest placement accuracy can be achieved with, for any type of productions requirements and to meet the demands of the Advanced Packaging markets.
ASMPT, known as the technology leader continues to proves that we provide a complete solution in the electronics manufacturing process.
Over the 3 show days, this is demonstrated as ASMPT will joint exhibit the DEK TQ with improved features, the latest version of the SIPLACE TX micron from SMT Solutions, and together with the back-end solutions from the SEMI Solutions segments.
At the booth, the new SIPLACE TX micron and the latest DEK TQ will be exhibited in a production line together, for the perfect advanced packaging combination. Featuring an improved SIPLACE SpeedStar placement head, and a DEK TQ designed for the smart factory, one can high production volume, faster, more accurate and flexible assembly.
In addition, DEK MASS – the mass alignment of Singulated Substrates (MASS), where printing accuracy and throughput can be achieved through stencil printing will be retrofitted on the DEK NeoHorizon to explain its capability will be presented at the booth as well.
ASMPT in Semicon China:
ASMPT booth: N3 - 3419
Date: 17 – 19 Mar
Time: 9am – 5pm (4pm on 19 Mar)
Please drop by to ASMPT booth, if you’re in the area.
Or, if you are unable to make it, but are interested in the ASM solutions, please contact us at: email@example.com
As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.