SMT topics in focus
Demand for smaller devices results in the rise of smaller and shrinking packages within these devices. As your package get smaller, and the leads connecting to your PCBs lessens, contact with the PCBs reduces too. With the ball placement process where depositing solder balls on the underside of these packages, you are increasing the interconnects between the package and PCB. Learn how ASM DEK Printers could help you achieve greater connectivity.
With the number of interconnects increasing over a shrinking package outline, the demand for ball grid arrays (BGA) and chip scale packages (CSP) has been increasing exponentially over the years. Ball placement process is the key stage of depositing solder balls on the underside of these packages, so that there are more connectivity between the package and the PCB
You could perform the ASM Ball Placement solution with the DEK Galaxy or the DEK Horizon ix.
A typical ASM ball placement line consists of 2 printers: the first printer is used to print flux onto the bond pads and the second machine to place solder spheres. The DEK ball placement option on the second printer consists of a ball transfer head which traverses on a custom dual layer stencil to deposit the solder ball into individual apertures and apply slight pressure to ensure that they are seated into the flux. Once the ball placement is completed on the printer, the substrate is then reflowed to complete the entire process.
The key benefits include:
The DEK ball placement option was introduced more than 10 years ago and remains the only solder ball placement solution enabled on a printer platform. Mentions about being the industry leader, ASM definitely lives up to its name.
For more information about the ASM Ball Placement Solution and the other solutions for Advanced Packages, you can read more on our brochure
For more information, you can contact us at: firstname.lastname@example.org
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