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SMT topics in focus


SMT topics in focus

ASM at Internepcon Japan 2020


The integrated smart factory becomes reality

Singapore, January 14, 2020 – Technology leader ASM presents innovative hardware and software solutions for the integrated smart factory at the Internepcon trade show being held at Tokyo Big Sight from January 15 to 17, 2020 (1st South Hall, Booth S2-34). The latest generations of the SIPLACE SX and SIPLACE TX placement platforms, powerful NeoHorizon printers and innovative software solutions exhibit the state of the art in electronics manufacturing. In addition to its SMT solutions, ASM has also set aside a special area of its booth for backend solutions such as its ultra-precise die and flip-chip bonders.

The placement solutions at the ASM booth cover the entire spectrum from high-volume to high-mix electronics production. The high-speed SIPLACE TX placement modules shown at the booth prove their superior precision in SIP placement applications. Also being shown are new products like the ASM AutoRefill Feeder and the ASM Measuring Feeder. The ASM AutoRefill Feeder has automatic tape entries for two component reels, which make the setup and refill procedures much more efficient, and the ASM Measuring Feeder delivers a significant improvement in process stability by verifying the major electrical properties of passive components.

The current benchmark solution for high-mix electronics production is the SIPLACE SX. Its interchangeable gantries, superior placement heads and feeder and transport options make it an extremely flexible and scalable placement platform. The latest generation’s improved vision system even recognizes damaged components via 3D imaging. Also new is the optional OSC Package, which allows for the reliable placement of snap-ins, radial, axial and odd-shaped components as well as the broad use of special feeders from other manufacturers.

Maximum control, starting with the printing process

The DEK NeoHorizon 03iX printer demonstrates its superior precision with a sample SiP (system-in-package) application. In addition, the ASM Smart Stencil RFID solution allows for the seamless control of each stencil’s printing cycles and service life.

“We want to show at the Internepcon how effectively our innovative hardware and software solutions can synchronize people, machines, materials and processes,” explains Yuzo Ishizaki, General Manager at ASM SMT Solutions Japan. “We are the first manufacturer featuring integrated and open data communication from the individual machine to the line, the factory, and the cloud. We also make sure that our solutions can be retrofitted and implemented in stages so that existing factories can also benefit from these improvements in quality, productivity and flexibility. Electronics manufacturers have in ASM a powerful partner for the step-by-step migration to the integrated smart factory.”

Control wall

The technology leader presents its comprehensive software products on a ‘control wall’ with the ASM Command Center at its center. It captures requests from the networked machines and automatically assigns them as prioritized and skill-based tasks to pools of ‘smart operators’ covering multiple lines. This approach revolutionizes the classic staff organization of SMT lines and makes the electronics manufacturer’s personnel utilization much more efficient. Other software solutions being presented include the ASM Performance Monitor and the modern MES from Critical Manufacturing.

ASM also presents a Service 4.0 concept under the ASM Academy name. Thanks to virtual reality, employees can now be trained in maintenance and operations duties offline or guided step-by-step through concrete operations on the machines.

Best-in-class solutions

As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.

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